RFID Inlay Injection Molding Parallel Flow

The patent removes the protective housing from the system entirely. The electronic element is placed directly into a recess in the mold core without any protective covering, and the injection-molded plastic container directly encapsulates and protects the element. This eliminates the intermediate protective housing component and simplifies the production process while maintaining protection of the electronic element.

The patent merges the electronic element directly into the plastic container structure through injection molding. The molten plastic material flows around and encapsulates the electronic element, creating an integral, inseparable connection. The element and container become a unified structure where the element cannot be removed without damaging either the element or the container, thereby ensuring security and originality while maintaining manufacturing simplicity.

The patent prepares the mold core with a recess before injection molding begins. The electronic element is placed into this pre-formed recess, which positions the element in a protected location. The recess acts as a buffer zone that absorbs the impact of incoming molten plastic material, preventing direct high-velocity impact on the electronic element while still allowing the element to be encapsulated and securely connected to the container.

The patent replaces the optical/mechanical barcode system with an electronic identification system (such as RFID tags or other electronic elements). Instead of using optical patterns that require line-of-sight scanning and can be visually manipulated, the invention uses electronic components that provide contactless reading capability, enhanced security features, and immunity to soiling or physical degradation. This substitution of mechanical/optical systems with electronic systems resolves the limitations of barcode technology.