Passive RFID Transponder Interposer Testing
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Solution Overview
Problem
The existing methods for testing interposers, which are critical in semiconductor chip stacking due to their small size and high density of connecting contacts, are inefficient and risk costly failures if defects are not detected before chip bonding, as they lack active components for built-in self-testing.
Innovation Solution
An external test method using a passive RFID transponder device that conducts short-circuit and open-circuit tests on interposers without physical contact, allowing for wafer-level evaluation of fabrication conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If physical probing methods are used to test interposer connections, then measurement precision may be improved, but device complexity and ease of operation deteriorate due to the small size and high density of connecting contacts
Solution Approach 1:
The patent introduces a passive transponder device as an intermediary between the test system and the interposer. This transponder contains an open/short test circuit that can be wirelessly activated, allowing indirect testing of interposer connections without requiring direct physical contact with the tiny connecting contacts, thus reducing test system complexity while maintaining measurement precision
Solution Approach 2:
The patent replaces the mechanical probing system with a wireless electromagnetic field-based testing system. By using RFID technology to activate the transponder and induce currents in the interposer conductive lines, the need for physical contact probes is eliminated, simplifying the test system while enabling accurate connection testing
2Ease of operation
If built-in self-test methods are applied to interposer, then ease of operation is improved, but reliability deteriorates because interposer lacks active components
Solution Approach 1:
The passive transponder acts as a mediator that provides self-testing capability. Although the interposer itself lacks active components, the transponder contains the necessary open/short test circuit that can be wirelessly activated to perform automated testing, combining ease of operation with reliable defect detection
Solution Approach 2:
The system enables self-service testing through the passive transponder that contains the test circuitry. The transponder can autonomously perform open/short tests on the interposer connections when activated by electromagnetic fields, providing reliable automated testing without requiring complex external test equipment
3Productivity
If chip bonding is performed without prior interposer testing, then productivity is improved, but loss of substance increases due to costly chip wastage from defective interposers
Solution Approach 1:
The patent implements preliminary testing of the interposer using the passive transponder method before chip bonding occurs. This allows defects to be detected and the interposer to be rejected beforehand, preventing costly chip wastage while maintaining high productivity by enabling rapid wireless testing that does not slow down the overall fabrication process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively evaluates interposer connections without physical probing, reducing the risk of defective interposers causing costly chip wastage by identifying fabrication issues before chip bonding, thus improving yield and reducing losses.
Implementation Method 1
A passive transponder device may be a radio-frequency identification (RFID) tag including at least one first circuit. The first circuit includes an open/short test circuit... A short-circuit or open-circuit test for the interposer is conducted through the checking area
Data Source
AI summary
A test method for an interposer is provided. The interposer includes a plurality of conductive lines therein and a plurality of connecting contacts thereon, wherein the connecting contacts are electrically connected to the conductive lines. The test method for an interposer provides a passive transponder device. The passive transponder device includes a first circuit including an open/short test circuit and at least a pair of connecting contacts. The test method for an interposer includes contacting the connecting contacts of the first circuit in the passive transponder device with the selected contacts on the interposer to form a checking area and conducting an open-circuit or short-circuit test for the interposer through the checking area.