RFID Label Adhesive Structure for Centrifugal Shear Resistance
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Solution Overview
Problem
RFID labels attached to test tubes and blood bags can experience connection failures due to sliding shear stresses caused by centrifugation, leading to peeling off of the RFID antenna and IC chip.
Innovation Solution
An RFID label configuration that includes an RFID inlay with an IC chip and RFID antenna, a hot melt-based adhesive layer, a thermoplastic resin sheet, and an adherend adhesive layer, laminated in a specific order to prevent peeling and connection failures during centrifugation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the RFID label is subjected to centrifugation, then the RFID label can be used in medical and testing fields for identifying test tubes and blood bags, but the sliding shear stress causes the RFID antenna and IC chip to peel off and connection failure to occur
Solution Approach 1:
The RFID label is divided into multiple functional layers: an RFID inlay containing the antenna and IC chip, a hot melt-based adhesive layer for bonding, a thermoplastic resin sheet as a protective barrier, and an adherend adhesive layer for attachment to the test tube or blood bag. This segmentation allows each layer to perform its specific function while collectively preventing connection failure during centrifugation.
Solution Approach 2:
The thermoplastic resin sheet is positioned between the hot melt-based adhesive layer and the adherend adhesive layer to act as a cushioning barrier. This beforehand cushioning protects the RFID antenna and IC chip from direct exposure to centrifugal forces, preventing peeling and connection failure before they can occur.
2Device complexity
If the RFID antenna and IC chip are connected directly, then the structure is simple, but the sliding shear stress during centrifugation causes connection failure
Solution Approach 1:
The RFID label employs a composite structure combining multiple materials with different properties: the RFID inlay substrate provides mechanical support, the hot melt-based adhesive layer provides bonding, the thermoplastic resin sheet provides protective cushioning, and the adherend adhesive layer provides attachment. This composite approach enhances reliability while maintaining reasonable structural complexity.
3Ease of manufacture
If the RFID label is attached directly to the adherend, then the attachment is simple, but the centrifugal force causes peeling off of the RFID antenna and IC chip
Solution Approach 1:
The thermoplastic resin sheet acts as an intermediary layer between the hot melt-based adhesive layer and the adherend adhesive layer. This intermediary provides a protective barrier that maintains the integrity of the RFID components during centrifugation while allowing the attachment process to remain relatively simple.
Solution Approach 2:
The thermoplastic resin sheet functions as a flexible protective film that can accommodate the centrifugal forces without causing peeling of the RFID antenna and IC chip. This thin film structure provides protection while maintaining flexibility and ease of attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed configuration effectively reduces sliding shear stresses and prevents connection failures between the RFID antenna and IC chip, ensuring reliable operation even under centrifugal forces.
Implementation Method 1
the thermoplastic resin sheet and the hot melt-based adhesive layer laminated on an adherend side of the RFID inlay can prevent the RFID antenna and the IC chip from being peeled off from each other
Data Source
AI summary
An RFID inlay, a hot melt-based adhesive layer laminated on a surface of the RFID inlay on which an RFID antenna and an IC chip are formed, a first thermoplastic resin sheet, and an adherend adhesive layer configured to be attached to an adherend are laminated in this order.