Heat-Resistant RFID Label With Arched Chip Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing RFID labels lack sufficient heat resistance to withstand high-temperature environments, which limits their application in fields such as product management and logistics.
Innovation Solution
The RFID label is designed with a heat-resistant substrate in a band shape, featuring a first and second portion divided by a base point, where the second portion is longer than the first, allowing it to form an arch shape away from the adherend, with adhesive layers and notches or perforations to maintain this configuration, keeping the antenna and IC chip protected from surface temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the RFID label uses a conventional substrate structure, then the manufacturing is simple, but the heat resistance is insufficient for high-temperature environments
Solution Approach 1:
The substrate is divided into a first portion and a second portion with different lengths in the longitudinal direction. The second portion extends beyond the first portion to form an overhanging structure that shields the antenna and IC chip from high temperatures. This segmentation allows different regions of the substrate to serve different functions: the first portion for adhesion and the second portion for thermal protection.
Solution Approach 2:
The substrate structure transitions from a conventional single-plane configuration to a multi-dimensional overhanging structure. The second portion extends in the longitudinal direction beyond the first portion, creating a three-dimensional protective configuration that physically shields the electronic components from thermal exposure.
2Temperature
If the antenna and IC chip are placed directly on the adherend surface, then the structure is compact, but the components are exposed to high surface temperatures
Solution Approach 1:
The extended second portion of the substrate acts as an intermediary protective barrier between the adherend surface and the antenna/IC chip. This intermediate structure absorbs and redirects thermal exposure away from the sensitive electronic components, allowing them to remain protected while maintaining functional integration.
Data Source
AI summary
An RFID label includes a heat-resistant substrate that has a first portion and a second portion divided by a base point portion intersecting a longitudinal direction and extending in a width direction, and has heat resistance; an antenna and an IC chip that are provided in the second portion; a first adhesive layer provided on the second portion; and a second adhesive layer provided on the first portion, a length of the second portion is formed to be larger than a length of the first portion in the longitudinal direction.