RFID Label Assembly With Protected Microchip Placement
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Solution Overview
Problem
Existing RFID assemblies are susceptible to damage and impact due to the microchip and fragile connections being located on areas prone to contact with other surfaces during transportation, leading to potential abrasion and malfunction.
Innovation Solution
The microchip and connection between the microchip and antenna are relocated to a protected location, such as the neck of the container or a pocket/overlap of the label, reducing the risk of impact and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the microchip and connection are located on the main body of the container, then the RFID assembly is easier to manufacture and apply, but the microchip and connection are susceptible to impact and damage during transportation
Solution Approach 1:
The patent moves the microchip and connection from the traditional flat label surface to the three-dimensional neck region of the container. This dimensional transition places the sensitive components in a protected location that is less susceptible to impact during transportation, while the antenna remains on the label surface for ease of manufacturing.
Solution Approach 2:
The RFID assembly is segmented into two distinct locations: the microchip and connection are placed on the container neck, while the antenna remains on the label. This segmentation allows each component to be positioned optimally - the microchip in a protected area and the antenna in an area conducive to manufacturing and signal transmission.
2Reliability
If the microchip is relocated to the neck of the container, then the microchip is less susceptible to impact, but the antenna footprint is reduced
Solution Approach 1:
The RFID assembly is divided into two spatial zones: the microchip resides on the container neck while the antenna is positioned on the label body. This segmentation resolves the conflict by allowing the microchip to occupy the protected neck region and the antenna to maintain its required footprint on the larger label surface.
Solution Approach 2:
The microchip is relocated to a different spatial dimension (the neck region) rather than competing for space on the label surface. This dimensional separation allows both the protected microchip location and adequate antenna footprint to coexist without compromising either requirement.
3Reliability
If the microchip and connection are placed in an overlapping label portion, then the microchip is protected from impact, but the manufacturing process becomes more complex
Solution Approach 1:
The patent utilizes the vertical dimension by placing the microchip on the container neck, which is a naturally protected three-dimensional feature. This approach achieves protection without requiring complex overlapping label structures, thereby maintaining ease of manufacture while ensuring reliability.
Data Source
AI summary
A radio-frequency identification (RFID) assembly is coupled to or formed with a label for a container. The RFID comprises an for receiving or sending a radio-frequency (RF) signal and a microchip. The microchip, in communication with the antenna, can store or process information and modulate or demodulate information via a radio-frequency (RF) signal. The RFID assembly, including the antenna and the microchip, is formed with or coupled to the label with the microchip disposed at a protected portion of the container.