Single-Substrate RFID Label Without a Silicone Release Liner
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Solution Overview
Problem
Conventional RFID labels require multiple layers and a release layer for attachment, making them costly and not environmentally friendly.
Innovation Solution
An RFID label with a siliconized first surface and an untreated second surface carrying the RFID tag and a sticky adhesive layer, eliminating the need for additional layers and allowing direct attachment without a silicone liner.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers and a release layer are used for attachment, then the label structure is stable and reliable, but the manufacturing cost increases and environmental impact worsens
Solution Approach 1:
The patent removes the release layer from the conventional RFID label structure. The substrate itself is provided with a release surface that provides sufficient release properties without requiring an additional release layer, thereby simplifying the structure while maintaining attachment reliability
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support, contains the release surface for attachment, and supports the antenna and IC. This multi-functionality eliminates the need for separate release layers and reduces overall structure complexity
2Reliability
If multiple layers and a release layer are used for attachment, then the label structure is stable and reliable, but the manufacturing cost increases
Solution Approach 1:
The release layer is extracted/removed from the structure. The substrate is directly provided with a release surface through treatment or coating during manufacturing, eliminating the need to manufacture and assemble a separate release layer, thereby reducing manufacturing cost
Solution Approach 2:
The release surface functionality is merged into the substrate itself. Instead of having a separate release layer as in conventional designs, the substrate is engineered to provide release properties directly, reducing the number of manufacturing steps and material costs
3Reliability
If multiple layers and a release layer are used for attachment, then the label structure is stable and reliable, but the environmental impact worsens
Solution Approach 1:
The release layer is removed from the structure, directly reducing material waste. Fewer layers mean less material consumption and simpler disposal or recycling processes, improving environmental sustainability
Solution Approach 2:
The release functionality is combined with the substrate material itself rather than being a separate layer. This reduces the total amount of material required and simplifies the label structure, leading to reduced material waste and improved environmental performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces material usage, costs, and environmental impact by enabling a single-substrate structure with efficient production and reduced carbon footprint, allowing for more labels per roll and less frequent roll exchanges.
Implementation Method 1
the first surface is siliconized
Data Source
AI summary
The present invention relates to an RFID label comprising an RFID tag which tag comprises an RFID antenna and an IC, which IC is attached onto the antenna such that the antenna and the IC forms the RFID tag. The inventive label further comprising an elongated substrate with a first surface and a second surface, wherein the first surface is siliconized, and the second surface is carrying the RFID tag, and a sticky adhesive layer which is arranged onto the second surface of the substrate and over the RFID tag.