Fixable RFID Labelling Medium for Heat-Safe Object Bonding

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Solution Overview

Problem

Existing labelling media with RFID components face issues of antenna damage from temperature loads, limited structure size and detail accuracy, and sensitivity to temperature fluctuations and mechanical stress.

Innovation Solution

A fixable labelling medium with an RFID component, featuring a carrier substrate and mould substrate, where the RFID component is enclosed between them, and an antenna structure manufactured via etching, providing high detail and accuracy, with the mould substrate bonding to an object under heat.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the RFID component is placed on the surface exposed to elevated temperature for fixing, then the labelling medium can be firmly attached to the object, but the chip or antenna structure will be damaged by temperature load

Engineering Contradiction:

Improvebonding strengthVSAvoidRFID component integrity

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent divides the labelling medium into distinct layers: a heat-resistant base layer that contacts the object during thermal fixing, and an RFID component layer that is positioned away from the direct heat path. This segmentation allows the base layer to withstand high temperatures while protecting the RFID component from thermal damage.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces a heat-resistant intermediate layer (such as a polymer film or adhesive layer) between the RFID component and the object surface. This intermediary layer acts as a thermal barrier, allowing the fixing process to proceed at high temperatures while preventing direct heat transfer to the RFID component, thus maintaining its integrity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If antenna printing method is used, then the labelling medium can be manufactured efficiently, but the structure size and detail accuracy are limited

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidantenna structure detail accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces the conventional printing method with a laser-based direct structuring method. Instead of using screens or stamps to print the antenna pattern, a focused laser beam directly writes the antenna traces onto the conductive material, enabling much finer feature sizes and higher precision while maintaining efficient manufacturing through automation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the manufacturing parameters by using laser power, scanning speed, and focal point control to achieve precise antenna structuring. By adjusting these parameters, the system can produce high-precision antenna patterns with fine details that are not achievable through traditional printing methods, while still maintaining high productivity through rapid laser processing.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If the RFID component is enclosed between carrier substrate and mould substrate, then temperature sensitivity is reduced, but the device complexity increases

Engineering Contradiction:

Improvetemperature sensitivityVSAvoidlabelling medium structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the carrier substrate and mould substrate into an integrated structure where the RFID component is encapsulated within a single multi-layer assembly. The layers are bonded together to form a unified component that provides both structural support and thermal protection, reducing the need for separate protective elements and simplifying the overall device architecture.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent designs the carrier substrate and mould substrate to serve multiple functions simultaneously: structural support, thermal insulation, mechanical protection, and integration with the fixing process. This multi-functionality reduces the need for additional components, thereby reducing overall device complexity while maintaining the protective enclosure for the RFID component.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces temperature sensitivity and protects the RFID component from thermal stress while ensuring a high level of detail and accuracy, enabling durable integration into objects through in-mould or post-mould fixing processes.

Implementation Method 1

The mould substrate is configured to bond to an object under the influence of heat

Methodology Applied

Scientific EffectHeat bonding: Heating

Implementation Method 2

the antenna structure is manufactured by means of an etching process

Methodology Applied

Scientific EffectEtching: Ablation

Data Source

PatentUS12547868B2Fixable labelling medium, method for manufacturing the fixable labelling medium, use of the fixable labelling medium and system consisting of a casting device/patch device and the fixable labelling medium

Publication Date: 2026.02.10 PMG BESITZ GMBH & CO KG

AI summary

The fixable labelling medium provides a carrier substrate and an RFID component with an antenna structure and a chip. The RFID component is configured to store information. The antenna structure is manufactured, for example, by means of an etching process. The fixable labelling medium can be fixed to an object.