RFID Manufacturing Process Using Curable Conductive Agent
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Solution Overview
Problem
The existing manufacturing processes for RFID identifiers, such as RFID labels and tags, are time-consuming due to the numerous manipulations required for assembling electronic chips with antennas, which hampers production efficiency.
Innovation Solution
A streamlined process where multiple electronic chips and antennas are assembled in a single operation using a hardened electrical conduction agent, eliminating the need for prior chip cutting and separate application of conductive glue, and incorporating methods like brazing or conductive glue with metallic particles for precise and fast electrical connections, along with resin infusion for enhanced stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electronic chips are cut individually and assembled one by one with antennas, then precise electrical connections can be achieved, but production time increases significantly
Solution Approach 1:
The patent merges multiple individual assembly operations into a single batch operation. Multiple electronic chips are arranged on a support structure, and a single overall layer of curable electrically conductive agent is applied to all antenna connection pads simultaneously. The support with chips is then applied against the antenna assembly in one operation, curing the conductive agent to establish all electrical connections at once, rather than assembling each chip-antenna pair individually.
Solution Approach 2:
The patent performs preliminary arrangement and positioning of multiple electronic chips on a support structure before the actual assembly with antennas. The chips are pre-positioned with their connection pads facing the antenna assembly, and the support structure is prepared in advance to enable simultaneous alignment with all antennas. This preliminary preparation allows the subsequent assembly operation to proceed efficiently in a single step.
2Reliability
If conductive glue is applied individually to each antenna, then precise electrical connections can be established, but the number of manipulations increases and production time is extended
Solution Approach 1:
The patent combines the application of conductive agent to multiple antenna connection pads into a single overall layer that covers all pads simultaneously. This single layer of curable electrically conductive agent is applied to the entire face of the antenna assembly, eliminating the need for multiple separate application operations for each antenna or connection pad.
Solution Approach 2:
The single overall layer of curable electrically conductive agent serves multiple functions simultaneously: it provides electrical conductivity for all chip-antenna connections, acts as an adhesive to bond the chip support to the antenna assembly, and can provide protective coverage. This multi-functional approach eliminates the need for separate conductive glue applications for each connection point.
3Productivity
If multiple chips and antennas are assembled in a single operation, then production time is reduced, but precise alignment and positioning become more challenging
Solution Approach 1:
The patent introduces a support structure as an intermediary element that facilitates precise alignment. The support structure includes positioning features such as guide pins, alignment marks, or mechanical fixtures that ensure accurate positioning of multiple electronic chips relative to the antenna assembly. This intermediary support structure enables simultaneous precise alignment of all chips with their corresponding antennas during the single batch assembly operation.
Solution Approach 2:
The patent segments the assembly process into distinct functional components: the support structure with pre-positioned chips, the antenna assembly with connection pads, and the curable electrically conductive agent. This segmentation allows each component to be prepared and positioned independently with precise tolerances, then assembled together in a single operation. The support structure itself can be segmented into regions corresponding to individual chip positions, enabling modular preparation and precise alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process significantly reduces production time by simplifying the assembly process and ensuring precise electrical connections, leading to a substantial saving in manufacturing time while maintaining the integrity of the RFID identifiers.
Implementation Method 1
curing said electrically conductive agent so that said agent makes an electrical connection between the electronic chips and the antennas of each pair
Implementation Method 2
an overall layer of a curable electrically conductive agent
Implementation Method 3
a heat-curable electrical conduction agent is used
Implementation Method 4
a press-curable electrical conduction agent is used
Implementation Method 5
a solder flux is used as a curable electrical conduction agent, so as to electrically connect the electronic chips and the antennas of each pair by soldering
Implementation Method 6
a conductive glue is used as a curable electrical conduction agent, so as to electrically connect the electronic chips and the antennas of each pair by gluing: such a conductive glue, which can be cured by heating and/or by pressing and/or over time, comprises suspended metal particles, making it possible to make electrical connections between the electronic chips and the antennas by crushing the chip support on the antenna support
Implementation Method 7
resin is inserted between the soldering points connecting the electronic chips to their antennas: this resin, which can be inserted between the two supports under vacuum by infusion
Implementation Method 8
makes it possible to increase the bonding surface between the electronic chip support and the antenna support, and to consolidate the stack thus obtained
Data Source
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AI summary
This process for manufacturing RFIDs, each comprising an electronic chip (1) and an antenna (5), comprises steps of: - manufacturing a plurality of electronic chips (1) on one face of a first carrier (3), - manufacturing a plurality of antennas (5) on one face of a second carrier (21), - covering said face of said first carrier (3) and/or said face of said second carrier (21) with a layer of a curable electrically conductive agent, - applying said first carrier (3) against said second carrier (21) so that said faces and pairs of electronic chips (1) and of antennas (5) face one another, - curing said electrically conductive agent so that said agent makes an electrical connection between the electronic chips (1) and the antennas (5) of each pair, and - dicing each electronic chip/antenna pair of said assembly.