RFID Manufacturing Method Splitting Substrates for Parallel Assembly
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Solution Overview
Problem
The existing manufacturing method for radio frequency identification devices is inefficient and costly due to the sequential fixing of modules and lead coils on a single substrate, limiting pre-storage of semi-finished products and increasing production costs.
Innovation Solution
The method involves preparing separate module and lead bearing substrates, arranging lead coils and modules on their respective substrates, and connecting them using adhesive joining, heat pressing, or ultrasonic welding, allowing for simultaneous or advance preparation of lead coils, which are then electrically connected to modules as needed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If modules and lead coils are arranged on the same substrate and fixed sequentially, then the structure is simple, but production efficiency is low and production cost increases
Solution Approach 1:
The patent divides the original single substrate into two separate substrates: a module bearing substrate for mounting modules and a lead bearing substrate for mounting lead coils. This segmentation allows independent preparation and parallel processing of modules and lead coils, eliminating sequential constraints and significantly improving production efficiency while maintaining structural simplicity through modular design.
Solution Approach 2:
The patent enables preliminary action by allowing lead coils to be prepared and mounted on the lead bearing substrate in advance, independently of module production. This preliminary preparation of lead coils on a separate substrate eliminates waiting time in the production process and enables just-in-time assembly, directly addressing the low production efficiency issue.
2Productivity
If modules are fixed on substrate first, then follow-up work can be carried out, but it is impossible to pre-store production capacity with semi-finished products
Solution Approach 1:
By segmenting the assembly into separate module bearing substrate and lead bearing substrate, the patent enables independent preparation of semi-finished products. Modules can be mounted on one substrate while lead coils are mounted on another, allowing both to be stored as semi-finished products and assembled later, thus enabling pre-storage production capacity without time loss.
Solution Approach 2:
The patent implements preliminary action by allowing modules to be mounted and prepared on the module bearing substrate in advance, creating storable semi-finished products. This preliminary preparation eliminates production time delays and enables just-in-time manufacturing, directly resolving the inability to pre-store production capacity.
3Ease of manufacture
If sequential assembly is used, then process control is simple, but production cost increases
Solution Approach 1:
The patent segments the manufacturing process into independent steps for module mounting and lead coil mounting on separate substrates. This segmentation simplifies process control by allowing each substrate preparation to be handled independently with standard procedures, while simultaneously reducing production costs through parallel processing and elimination of rework, directly addressing the cost increase issue.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves production efficiency and reduces costs by enabling rapid assembly of radio frequency identification devices according to client orders and allowing for efficient use of resources, with the ability to produce devices quickly and cost-effectively.
Implementation Method 1
the lower surface of the entire lead bearing substrate is connected with the upper surface of the entire module bearing substrate by adopting heat pressing or adhesive joining or locating plunger or ultrasonic welding
Implementation Method 2
the lower surface of the entire lead bearing substrate is connected with the upper surface of the entire module bearing substrate by adopting heat pressing or adhesive joining or locating plunger or ultrasonic welding
Implementation Method 3
the lower surface of the entire lead bearing substrate is connected with the upper surface of the entire module bearing substrate by adopting heat pressing or adhesive joining or locating plunger or ultrasonic welding
Implementation Method 4
the electric connecting method adopted in the step 5 is electric resistance welding or braze welding
Implementation Method 5
the electric connecting method adopted in the step 5 is electric resistance welding or braze welding
Data Source
Figure 1~3
Figure 4~6
Figure 7~9
AI summary
The invention is concerned about a radio frequency identification device, which comprises of a module bearing substrate (1) and a lead bearing substrate (2). A module (3) is arranged on the module bearing substrate (1), a lead coil (5) is arranged on the lead bearing substrate (2); one surface of module bearing substrate (1) is connected with one surface of entire lead bearing substrate (2); the module (3) is electrically connected with the lead coil (5). The manufacturing method of the invention includes the following steps: prepare an entire module bearing substrate and an entire lead bearing substrate respectively; embed multiple lead coils (5) on the entire lead bearing substrate according to the setting positions respectively; fix multiple modules (3) on the entire module bearing substrate according to the setting positions; connect one surface of the entire module bearing substrate with one surface of the entire lead bearing substrate; each lead coil (5) is electrically connected with corresponding module (3). The goal of this invention is to provide a radio frequency identification device and its manufacturing method with low production cost and high production efficiency.