RFID Marking Label Weld Sealing for Sterilization Moisture Protection

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Solution Overview

Problem

Conventional electronic labels with RFID functionality are prone to corrosion and loss of performance due to moisture penetration, especially during sterilization processes, making them unsuitable for use on products that require such treatments.

Innovation Solution

A marking label with an RFID transponder and antenna structure is sealed by a weld seam between a sealing layer and a substrate, forming a moisture barrier that protects the RFID functionality, using materials like PET or PE films that can be bonded by welding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional electronic labels with RFID functionality are used, then the labeling function is achieved, but moisture penetration causes corrosion and loss of performance during sterilization processes

Engineering Contradiction:
ImproveRFID functionality reliabilityVSAvoidmoisture penetration
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The RFID transponder is nested within a sealed enclosure formed by the substrate and sealing layer, which are bonded together by a weld seam. This nested structure protects the RFID components from moisture penetration during sterilization processes while maintaining functionality.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The weld seam acts as an intermediary sealing element between the substrate and sealing layer, creating a moisture barrier that prevents harmful moisture from reaching the RFID transponder while allowing the label to maintain its structural integrity and functionality.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If protective films are added to prevent moisture penetration, then moisture protection is improved, but the device complexity and production cost increase

Engineering Contradiction:
Improvemoisture protectionVSAvoidlabel structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The sealing function is merged into the label structure itself by bonding the sealing layer to the substrate through welding, eliminating the need for separate protective films or additional protective layers. This integration maintains moisture protection while reducing overall complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The welding process replaces traditional mechanical sealing methods or adhesive-based protective films. By using a weld seam to bond the sealing layer to the substrate, the label achieves reliable moisture protection through a more efficient and integrated approach that reduces structural complexity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If adhesive layers are used to attach the sealing layer, then bonding is achieved, but moisture can still penetrate laterally through the adhesive

Engineering Contradiction:
Improvesealing layer bondingVSAvoidlateral moisture penetration
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The welding process replaces adhesive bonding to attach the sealing layer to the substrate. This substitution eliminates the lateral moisture penetration pathway that exists in adhesive layers, as the weld seam creates a continuous, impermeable bond that prevents moisture ingress while maintaining strong attachment.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The seal effectively prevents moisture ingress, ensuring the RFID functionality remains intact after sterilization processes, providing reliable and durable identification without additional protective layers.

Implementation Method 1

The sealing layer is bonded to a substrate by welding so that the RFID chip and/or the antenna structure is surrounded by a weld seam and enclosed between the sealing layer and the substrate

Methodology Applied
Scientific EffectWelding: Welding

Data Source

PatentUS12393814B2Marking label, marking system and method for producing a marking label
Publication Date: 2025.08.19 SCHREINER GRP GMBH & CO KG
  • US12393814B2 patent drawing
  • US12393814B2 patent drawing
  • US12393814B2 patent drawing

AI summary

A marking label includes an RFID transponder with an RFID chip and an antenna structure which are coupled to one another by signal technology, and a sealing layer which covers the RFID transponder. The sealing layer is bonded to a substrate by welding so that the RFID chip and/or the antenna structure is surrounded by a weld seam and enclosed between the sealing layer and the substrate.