RFID Metal Card Coating with Laser-Etched Graphics

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Solution Overview

Problem

Producing a metal transaction card with dual interface functionality while maintaining structural rigidity and the desired 'metallic' sound, as well as integrating electronic components and aesthetic design, poses an engineering challenge.

Innovation Solution

A method involving the use of thermosetting resin to encapsulate and fill module openings, apertures, and recesses in metal transaction cards, ensuring structural integrity and maintaining the metallic sound, while allowing for the integration of electronic components and dual interface functionality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a booster antenna circuit and magnetic shielding layer are added to enable contactless functionality, then dual interface functionality is achieved, but structural rigidity and metallic sound are compromised

Engineering Contradiction:

Improvedual interface functionalityVSAvoidstructural rigidity

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The patent uses a composite structure combining metal layers with thermosetting resin to create a card that maintains structural rigidity while accommodating electronic components. The resin fills gaps and provides mechanical support without compromising the metallic sound or strength of the card body.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The thermosetting resin acts as an intermediary material between the metal layers and electronic components. It fills the spaces created by the booster antenna circuit and magnetic shielding layer, providing structural support and maintaining the card's metallic characteristics while enabling dual interface functionality.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If electronic components are embedded into the metal card body to enhance functionality, then adaptability is improved, but device complexity increases

Engineering Contradiction:

Improveembedded electronics functionalityVSAvoidintegration complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent employs preliminary actions by pre-forming recesses and openings in the metal layers before embedding electronic components. The thermosetting resin is then applied to fill these pre-prepared spaces, providing a structured approach that simplifies the integration process and reduces overall complexity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The thermosetting resin serves as a mediating material that facilitates the embedding of electronic components. It provides a compliant medium that allows components to be integrated into the metal card body without requiring complex machining or assembly operations, thereby reducing device complexity.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Shape

If mechanical engraving or laser etching is applied to the metal surface to create aesthetic features, then appearance is enhanced, but structural integrity and metallic sound may be compromised

Engineering Contradiction:

Improveaesthetic design featuresVSAvoidstructural integrity

Core Design Contradiction:

ShapeVSStrength

Solution Approach 1:

The patent applies local quality by using thermosetting resin specifically in areas where aesthetic features are created. The resin fills the engraved or etched areas, providing structural reinforcement and maintaining the metallic sound while preserving the visual appearance of the design features.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The combination of metal layers with thermosetting resin creates a composite structure where the resin compensates for any structural weaknesses introduced by mechanical engraving or laser etching. This maintains both the aesthetic appearance and structural integrity of the card surface.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method ensures the metal transaction card maintains structural rigidity and desired acoustic properties while enabling dual interface functionality and embedding electronic components, such as a fingerprint sensor or dynamic display, with a sophisticated appearance.

Implementation Method 1

A method involves the use of thermosetting resin to encapsulate and fill module openings, apertures, and recesses in metal transaction cards

Methodology Applied

Scientific EffectEncapsulation: Physical Containment

Implementation Method 2

ensuring structural integrity and maintaining the metallic sound

Methodology Applied

Scientific EffectStructural support:

Data Source

PatentUS12427735B1Plating and coating of RFID enabled metal transaction cards with mechanically engraved and laser etched features

Publication Date: 2025.09.30 METALAND LLC

AI summary

Encapsulating the rear side of a top metal layer of a metal transaction card with a thermosetting resin, applying a primer to the front side of the top metal layer and drying in an oven before spraying a thermoset powder coating thereon, laser etching and mechanically engraving graphic elements into the powder coating to reveal the bare metal surface, inkjet printing graphic features to the powder coat. Encapsulating the rear side of a bottom metal layer of the card with a thermosetting resin, applying a primer to the rear side of the bottom metal layer and drying in an oven before digitally printing artwork, applying a protective overlay layer with magnetic stripe to the printed graphics, applying a primer or an adhesive film to the thermosetting to enable lamination of the top metal layer to the bottom metal layer.