RFID Tag Microchip Integration via Electrostatic Transfer

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current RFID tags face limitations in miniaturization and integration due to the size constraints of micro chips, which restrict their functionality and operational range, especially when using vacuum chucking equipment, and require larger chip sizes for handling, leading to increased costs and stress in bonding processes.

Innovation Solution

The integration of micro RFID chips onto a substrate with a conductive antenna pattern using electrostatic transfer and bonding techniques, allowing for reduced chip sizes, elimination of underfill encapsulation, and the use of smaller technology nodes, enabling smaller logic components and reduced stress levels, while also incorporating micro LED devices for visual notifications.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If larger micro chip sizes are used for handling with vacuum chucking equipment, then ease of operation is improved, but device complexity and cost increase

Engineering Contradiction:

Improveease of handlingVSAvoidchip size

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The patent replaces vacuum chucking equipment with electrostatic transfer equipment for handling micro chips. This substitution allows the use of smaller chips (reducing device complexity) while maintaining ease of operation through electrostatic forces that can effectively grip smaller dimensions without requiring the mechanical capabilities of vacuum systems.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If larger chip sizes are used for bonding, then reliability is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvebonding reliabilityVSAvoidbonding precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the bonding approach by eliminating the need for underfill encapsulation and reducing stand-off bond pad height to less than 50 μm. These parameter changes reduce the precision requirements for bonding while maintaining reliability, as the reduced stand-off height decreases the lever arm for stress and the elimination of underfill removes a potential failure point.

Inventive Principle:

Principle #35Parameter changes

3Device complexity

If smaller technology nodes are used for logic, then device complexity is reduced, but manufacturing precision requirements increase

Engineering Contradiction:

Improvelogic component sizeVSAvoidfabrication precision

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The patent uses electrostatic transfer equipment that is specifically designed to handle the precision requirements of smaller technology nodes. The electrostatic forces provide controlled and adjustable gripping forces that can accommodate the reduced dimensions without requiring the extremely tight tolerances that would be needed for mechanical vacuum chucking systems.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Device complexity

If chip size is reduced below vacuum chucking limitations, then device complexity is reduced, but ease of operation deteriorates

Engineering Contradiction:

Improvechip sizeVSAvoidease of handling

Core Design Contradiction:

Device complexityVSEase of operation

Solution Approach 1:

The patent substitutes mechanical vacuum chucking with electrostatic transfer equipment. This replacement enables the handling of smaller chips (reducing device complexity) while maintaining ease of operation through electrostatic forces that can effectively grip smaller dimensions without requiring the mechanical capabilities of vacuum systems.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of smaller, more cost-effective RFID tags with enhanced functionality, increased operational range, and reduced stress in bonding, facilitating integration of micro chips below the limitations of existing vacuum chucking equipment and enabling tailored applications with reduced chip sizes and costs.

Implementation Method 1

The micro chips are picked up using electrostatic transfer equipment

Methodology Applied

Scientific EffectElectrostatic forces: Electrostatics

Implementation Method 2

A line break is formed in the antenna feed line by laser cutting the conductive pattern

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS9542638B2RFID tag and micro chip integration design

Publication Date: 2017.01.10 APPLE INC

AI summary

An integrated micro chip, method of integrating a micro chip, and micro chip integration system are described. In an embodiment, a micro chip such as a micro RFID chip or integrated passive device (IPD) is electrostatically transferred and bonded to a conductive pattern including a line break. In an embodiment, the line break is formed by a suitable cutting technique such as laser laser ablation, ion beam etching, or photolithography with chemical etching to accommodate the micro chip.