RFID Circuit Module Layout for Substrate Warpage Control
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Solution Overview
Problem
Existing RFIC modules face challenges in reducing warpage and deformation of substrates when miniaturized, leading to issues like unwanted radiation, coupling, and connection failures due to unbalanced conductor patterns and substrate warping.
Innovation Solution
A circuit module design that includes a substrate with a dummy conductor pattern formed by heat curing of conductive paste on both surfaces, which helps balance the conductive paste and maintain substrate flatness, thereby reducing warpage and deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the substrate size is reduced to miniaturize the RFIC module, then the module size is reduced, but substrate warpage and deformation occur due to unbalanced conductor pattern distribution
Solution Approach 1:
The patent applies local quality by adding dummy conductor patterns specifically in regions where conductor density is imbalanced. These dummy patterns are strategically placed to compensate for local density variations caused by miniaturization, thereby maintaining substrate flatness in critical areas without increasing overall module size.
Solution Approach 2:
The patent changes the physical parameters of the conductor patterns by adjusting their density, area, and distribution. Dummy conductor patterns are designed with specific parameters (larger area, different spacing) to counterbalance the unbalanced conductor distribution, thus resolving the warpage issue while maintaining compact dimensions.
2Volume of moving object
If multiple coils are placed in close proximity to reduce module size, then the module is miniaturized, but unwanted radiation and coupling increase
Solution Approach 1:
The patent introduces dummy conductor patterns as intermediary elements between the functional coils. These dummy patterns act as shields or isolators that reduce electromagnetic coupling and unwanted radiation between closely spaced coils, enabling miniaturization without compromising electromagnetic compatibility.
Solution Approach 2:
The patent converts the potentially harmful effect of close coil proximity into a benefit by using the dummy conductor patterns to manage and control the electromagnetic fields. The close spacing enables miniaturization, while the dummy patterns redirect and contain the electromagnetic energy, preventing harmful radiation and coupling.
3Device complexity
If conductor pattern density varies significantly in the plane direction to achieve compact layout, then module integration is improved, but partial deformation of the substrate increases
Solution Approach 1:
The patent applies local quality by adding dummy conductor patterns specifically in regions where conductor density creates unbalanced stress. These dummy patterns are strategically placed in high-density areas to compensate for the imbalance, thereby preventing localized substrate deformation while maintaining high circuit integration.
Solution Approach 2:
The patent addresses asymmetry in conductor distribution by introducing symmetric dummy patterns that balance the overall conductor layout. The dummy patterns create a more symmetric stress distribution across the substrate, counteracting the asymmetric deformation caused by concentrated conductor patterns in compact designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively reduces substrate warpage and deformation, ensuring stable mounting and connection of RFIC modules, and maintaining consistent electrical characteristics even after miniaturization.
Implementation Method 1
a circuit disposed on the first surface and the second surface of the substrate with a conductor pattern obtained by heat curing of conductive paste
Data Source
AI summary
A circuit module is provide that includes a substrate including a first surface and a second surface that are opposite to each other, an IC mounted on the first surface of the substrate, a circuit disposed on the first surface and the second surface of the substrate with a conductor pattern obtained by heat curing of conductive paste, and connected between the IC and an external circuit, and a dummy conductor pattern obtained by heat curing of the conductive paste, disposed on at least one of the first surface and the second surface of the substrate, and configured to maintain a balance of the conductive paste on the first surface and the second surface of the substrate.