Multi-Surface RFID IC Antenna Contacts for Assembly
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Solution Overview
Problem
As RFID IC sizes shrink, the cost of assembling antenna contacts to antenna terminals increases due to alignment and bondwire attachment tolerances, making conventional assembly methods costly and complex.
Innovation Solution
Placing antenna contacts on different surfaces of the IC allows for simplified and cost-effective assembly by increasing the effective area and providing natural separation between contacts, enabling electrical coupling through a substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If antenna contacts are located on only one surface of the RFID integrated circuit, then the structure is simpler and manufacturing is easier, but the antenna cannot be properly connected to the RFID integrated circuit
Solution Approach 1:
The patent transitions from a single-surface contact configuration to a multi-surface contact configuration. The antenna contacts are positioned on multiple surfaces of the RFID integrated circuit package, utilizing three-dimensional spatial arrangement to achieve proper electrical connection between the antenna and the RFID integrated circuit, thereby resolving the connection reliability issue without requiring overly complex structures.
2Volume of moving object
If the RFID integrated circuit is placed directly on the antenna, then the assembly is more compact, but the RFID integrated circuit is exposed to moisture and other environmental factors
Solution Approach 1:
The patent implements a nested structure where the RFID integrated circuit is housed within a protective package that contains a desiccant. The desiccant is nested inside the package along with the RFID integrated circuit, creating a protective environment that prevents moisture exposure while maintaining compact dimensions. This nested arrangement protects the sensitive electronics from environmental harm factors.
3Object-affected harmful factors
If a desiccant is added to protect the RFID integrated circuit from moisture, then environmental protection is improved, but the overall size of the RFID tag increases
Solution Approach 1:
The patent merges the protective package and the desiccant into a single integrated component. The desiccant is incorporated within the package structure itself, combining the functions of mechanical protection and moisture absorption into one unified element. This integration allows effective moisture protection to be achieved without a significant increase in the overall RFID tag volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces alignment and attachment costs, facilitates easier assembly, and allows for more robust and efficient coupling of ICs to antennas, improving the manufacturing process while maintaining RF response generation capabilities.
Implementation Method 1
electrically coupling a first antenna contact to a first antenna terminal and electrically coupling a second antenna contact to a second antenna terminal
Implementation Method 2
A tag may generate the response either originally, or by reflecting back a portion of the interrogating RF wave in a process known as backscatter
Data Source
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AI summary
Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.