RFID Antenna Integrated into Packaging Foil
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Solution Overview
Problem
Current methods for producing RFID electronic tags that can be destroyed after use are complex and costly, failing to provide a low-cost solution for tags integrated into packaging that can be effectively disabled when the product is opened or discarded.
Innovation Solution
The method involves using the metal film of packaging foils to form RF or UHF antennas by removing metal material to create an antenna pattern, either through mechanical or chemical processes, allowing for the integration of RFID tags into packaging that can be easily destroyed when the product is opened or discarded.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the antenna is produced on scratch-off material or pre-cut medium requiring user removal, then the tag can be destroyed by the user, but the structure becomes more complex and cost increases
Solution Approach 1:
The patent combines the antenna with the packaging foil itself, eliminating the need for separate scratch-off materials or pre-cut media. The antenna is formed directly on the packaging foil through selective removal of conductive material, merging the packaging structure with the RFID tag structure.
Solution Approach 2:
The packaging foil serves dual functions: it provides packaging protection and simultaneously forms the RFID antenna. This multi-functional design eliminates the need for additional components dedicated solely to tag destruction, reducing overall complexity.
2Reliability
If the antenna is produced on scratch-off material or pre-cut medium requiring user removal, then the tag can be destroyed by the user, but the manufacturing cost increases
Solution Approach 1:
The patent combines the antenna with the packaging foil itself, eliminating the need for separate scratch-off materials or pre-cut media. The antenna is formed directly on the packaging foil through selective removal of conductive material, merging the packaging structure with the RFID tag structure.
Solution Approach 2:
The packaging foil itself provides the antenna function, eliminating the need for additional specialized materials. The existing conductive layer on the packaging foil is utilized and selectively removed to form the antenna, making the system self-sufficient.
3Ease of manufacture
If the metal film of packaging foil is used to form the antenna by removing metal material, then the tag can be integrated into packaging at low cost, but the packaging structure is modified
Solution Approach 1:
The patent applies local quality changes by selectively removing conductive material from specific areas of the packaging foil while leaving other areas intact. This allows the antenna pattern to be formed only where needed, preserving the packaging structure in non-antenna regions.
Solution Approach 2:
The patent changes the electrical parameters of the packaging foil by selectively removing conductive material to create the antenna pattern. This modifies the electrical properties (conductivity distribution) without fundamentally changing the physical packaging structure or material composition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of low-cost RFID tags that can be integrated into packaging, providing a cost-effective solution for destroying the tag when the product is opened or discarded, addressing consumer privacy concerns while maintaining the tag's functionality during use.
Implementation Method 1
removing metal material so as to provide an antenna pattern
Implementation Method 2
removing metal material so as to provide an antenna pattern
Data Source
AI summary
A method for manufacturing an electronic tag to be affixed onto a product includes providing, in an electrically conductive film of a foil for packaging, packing or transporting the product, areas devoid of any electrically conductive material for delimiting in the electrically conductive film at least one antenna pattern for forming an antenna for an RFID tag. A semiconductor chip is connected to the antenna for forming an electronic tag.


