RFID Module Pad Electrode Deformation Prevention
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Solution Overview
Problem
RFID tags with chip electronic components embedded in laminated thermoplastic resin layers face thickness limitations and electrical characteristic degradation due to deformation of pad electrodes during lamination, leading to potential contact with the IC chip edges and malfunctions.
Innovation Solution
A component built-in device with a laminated body of thermoplastic resin layers, featuring a coil-shaped conductor pattern and a belt-shaped or annular insulator pattern around the chip electronic component to prevent deformation and maintain electrical stability, where the insulator pattern acts as a reinforcing member to reduce pad electrode displacement and prevent electrical conduction with the IC chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the IC chip is embedded in the laminated body of thermoplastic resin layers, then the module can be thinned and made flexible, but the pad electrode deforms and may contact the IC chip edge during lamination
Solution Approach 1:
The patent applies preliminary action by forming the conductor pattern on the resin sheet before lamination. This allows the pad electrode to be pre-positioned and the resin to be prepared in advance, so that during the subsequent lamination process, the pre-formed conductor pattern maintains its shape and prevents deformation that would otherwise cause contact with the IC chip edge.
Solution Approach 2:
The patent applies local quality by forming the conductor pattern specifically on the resin sheet where it will contact the IC chip. This localized treatment ensures that only the necessary areas have the conductive properties needed for electrical connection, while maintaining the overall flexibility and thinness of the module. The conductor pattern is precisely positioned to avoid deformation during lamination.
2Adaptability or versatility
If the pad electrode is deformed during collective lamination, then the structure becomes flexible, but the electrical characteristic is degraded or malfunction is generated
Solution Approach 1:
The conductor pattern is formed on the resin sheet before lamination, establishing the electrical connection path in advance. This preliminary formation ensures that the pad electrode maintains its intended shape and position, preventing deformation during the flexibility-inducing lamination process while preserving electrical characteristics.
Solution Approach 2:
The conductor pattern is locally applied on the resin sheet at specific positions where electrical connection is needed. This localized conductive structure maintains electrical stability in critical areas while allowing the rest of the module to remain flexible through the lamination process.
Data Source
AI summary
An RFID module includes a laminated body including thermoplastic resin layers, a passive element defined by a conductor pattern on the thermoplastic resin layers, and an RFID IC chip embedded in the laminated body. The RFID IC chip and the conductor pattern are connected to each other by joining an input and output terminal of the RFID IC chip and a pad electrode, and an insulator pattern overlapping the pad electrode is provided around the RFID IC chip in the laminated body in planar view.