RFID Transponder Roll-to-Roll Bonding via Melting Contact Pads
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Solution Overview
Problem
The production of RFID transponders on carrying substrates, such as smart labels and intelligent packaging products, is cumbersome and costly due to the need for separate equipment and complex, time-consuming processes, particularly in connecting ICs to antennas, which requires high precision and results in long lead times and large capital expenditures.
Innovation Solution
A roll-to-roll method and apparatus that electrically connects antenna elements on a first substrate to contact pads on a second substrate by heating the contact pads to a temperature at or above their characteristic melting point, allowing for a simple and fast connection with relatively low precision, using substrates with integrated circuits and contact pads made of materials like tin and bismuth alloys.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional separate equipment and complex processes are used to produce RFID transponders, then connection precision between IC and antenna can be maintained, but production time increases and productivity decreases
Solution Approach 1:
The invention changes the physical state parameter of the contact pad material by heating it to its melting point, transforming it from solid to liquid state. This phase change enables the material to flow and form reliable electrical connections between the antenna and IC rapidly, resolving the contradiction between connection precision and production speed by using thermal energy to achieve both high-quality connections and fast processing
Solution Approach 2:
The contact pad material undergoes a phase transition from solid to liquid when heated to its melting point. This phase transition allows the material to become pliable and form conformal connections with the antenna elements, achieving both precise electrical contact and rapid processing without requiring complex alignment equipment
2Reliability
If multiple separate equipment and complex production steps are used, then connection reliability can be maintained, but device complexity and capital expenditure increase
Solution Approach 1:
The invention merges multiple separate production steps (antenna fabrication, IC mounting, electrical connection) into a single integrated process where all components are connected simultaneously through the melting and bonding of contact pads. This consolidation maintains connection reliability while dramatically reducing equipment complexity and capital expenditure by eliminating the need for multiple separate machines
3Strength
If traditional IC connection methods are used, then connection strength can be ensured, but production lead time increases
Solution Approach 1:
The invention uses periodic thermal action by applying heat to melt the contact pad material and then allowing it to cool and solidify, creating strong bonds. This cyclic heating and cooling process achieves both strong mechanical and electrical connections in a single rapid cycle, eliminating the need for multiple sequential steps and reducing production lead time while ensuring connection strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly simplifies and speeds up the connection process, reducing production time to milliseconds, enabling efficient and automated production of RFID transponders with improved control over the process, reduced equipment needs, and flexibility in using the same substrates for various applications, thus lowering costs and increasing efficiency.
Implementation Method 1
heating the contact pad(s) to a temperature at least equal to a characteristic melting point of said at least contact pads
Implementation Method 2
heating the contact pad(s) to a temperature at least equal to a characteristic melting point of said at least contact pads, thereby electrically connecting the antenna element to said at least one contact pad
Data Source
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AI summary
Method and apparatus for producing RFID transponders (400) arranged on a carrying substrate, comprising:providing a first substrate (100), the first substrate having at least one antenna element (101) arranged thereon, and preferably several antenna elements arranged sequentially thereon along a longitudinal extension of the first substrate, each antenna element being formed by an electrically conductive pattern; providing a second substrate (200), the second substrate (200) having at least one RFID strap, each RFID strap comprising an IC (202) and at least one contact pad (201) coupled to the IC, and preferably several RFID straps being arranged sequentially along a longitudinal extension of the second substrate; and electrically connecting an antenna element (101) on the first substrate to the at least one contact pad on the second substrate by bringing said first and second substrates together, thereby bringing said antenna element in mechanical contact with said at least one contact pad, and heating the contact pad(s) to a temperature at least equal to a characteristic melting point of said at least contact pads, thereby electrically connecting the antenna element to said at least one contact pad.