RFID Flat Sheet Material Polymer Composite Layer
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Solution Overview
Problem
Existing methods for producing radio frequency identification (RFID) materials require expensive and limited bulking paper to ensure chip flatness, leading to potential chip detachment and restricted printing flexibility due to the need for high-precision equipment and additional layers.
Innovation Solution
A flexible sheet material with a polymer composite intermediate layer that forms a flat surface around RFID components, allowing for simple and cost-effective production and compatibility with various printing methods, using a polymer film that adheres to and protects the components while maintaining flatness and elasticity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If bulking paper is used to ensure chip flatness, then surface flatness is improved, but production cost increases and manufacturing complexity increases
Solution Approach 1:
The patent replaces expensive bulking paper with ordinary paper combined with a foam adhesive layer. The foam layer acts as a disposable cushioning element that can be easily applied and removed, providing the necessary bulk and flatness without the high cost of specialized bulking paper.
Solution Approach 2:
The patent creates a composite structure using ordinary paper and foam adhesive material. This combination leverages the low cost and printability of ordinary paper with the cushioning and flattening properties of foam, achieving surface flatness without requiring expensive specialized paper.
2Shape
If bulking paper is used to ensure chip flatness, then surface flatness is improved, but chip reliability deteriorates due to mechanical stress
Solution Approach 1:
The patent applies a foam adhesive layer that serves as a cushioning element before the chip is mounted. This foam layer absorbs mechanical stresses and prevents direct transmission of force to the chip, thereby protecting the chip from damage while maintaining surface flatness.
Solution Approach 2:
The patent changes the physical state of the adhesive from a rigid or semi-rigid material to a foam material with elastic properties. This parameter change allows the adhesive to deform under stress and return to its original shape, providing continuous protection to the chip while maintaining flatness.
3Shape
If additional layers and high-precision equipment are used, then surface flatness is improved, but device complexity increases
Solution Approach 1:
The patent extracts the cushioning and flattening function from the paper structure itself and places it in a separate foam adhesive layer. This allows the use of ordinary paper without requiring complex modifications to the paper or the need for high-precision equipment to create flatness.
Solution Approach 2:
The patent uses a foam adhesive layer that can conform to the chip and surrounding area, providing a flexible solution for achieving flatness. This flexible approach eliminates the need for rigid, precision-engineered structures or complex equipment.
4Ease of manufacture
If ordinary paper is used instead of bulking paper, then manufacturing cost decreases and printing flexibility improves, but surface flatness deteriorates
Solution Approach 1:
The patent introduces a foam adhesive layer as an intermediary between the ordinary paper and the chip. This intermediary layer provides the necessary cushioning and flattening that ordinary paper alone cannot achieve, while allowing the use of low-cost, easily printable ordinary paper.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a flat, flexible, and durable surface for printing on both sides, ensuring consistent performance across different printing methods and environmental conditions, while protecting RFID components from mechanical stress and extending their lifespan.
Implementation Method 1
The polymer composite is applied in a liquid state and then polymerized to form a protective layer that maintains flatness and elasticity
Implementation Method 2
The polymer composite is applied in a liquid state with specific viscosity to flow around protruding elements and form a flat surface
Data Source
AI summary
The invention relates to the field of radio-frequency identification, in particular, to materials containing radio-frequency tags in their layers and intended for printing and stamping by commonly available printing methods. The technical result of the invention is to obtain the flexible flat sheet material in which the chips and other electronic components do not affect the level of the sheet material surface flatness. The flat sheet material with radio frequency identification contains the sequentially arranged first layer of flexible material, the first intermediate layer, the substrate layer with an antenna and a chip, the second intermediate layer, the second layer of flexible material, and the first intermediate layer made of the polymer composite.