RFID Switch Module Recess for Secure Anti-Skimming

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing RFID devices face challenges in cost and quality due to the need for cold lamination to connect actuation sensors, which increases manufacturing costs and may not meet ISO standards, and lack effective anti-skimming protection.

Innovation Solution

Integrating a switch module with a recessed configuration and electrical contacts on the RFID device body, allowing for secure and reliable connection of a protection module after high-temperature lamination, using a pre-laminate with meanders or copper pads for the protection module, and strip-like electrical contacts for precise positioning and increased manufacturing tolerance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If cold lamination is used to connect actuation sensors, then the connection is achieved, but manufacturing costs increase and ISO standards may not be met

Engineering Contradiction:
Improvemanufacturing costVSAvoidconnection quality
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies preliminary action by pre-defining the recess structure and electrical contact positions on the laminate layers before the lamination process. The recess is formed and electrical contacts are positioned in advance, allowing the actuation sensor to be integrated during normal lamination without requiring post-manufacturing cold lamination operations. This eliminates the need for costly cold lamination while ensuring proper connection quality.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent segments the RFID device structure by creating a dedicated recess area that separates the actuation sensor integration zone from the rest of the card body. This segmentation allows the sensor to be integrated into a specific region with pre-prepared electrical contacts, enabling standard high-temperature lamination processes to be used without affecting the overall connection quality or requiring additional cold lamination steps.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If high-temperature lamination is used, then manufacturing costs are reduced, but the protection module may be damaged

Engineering Contradiction:
Improvemanufacturing costVSAvoidprotection module integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The recess structure is prepared in advance with pre-positioned electrical contacts before the high-temperature lamination process. This preliminary preparation allows the actuation sensor to be integrated during the lamination process itself, eliminating the need for separate post-manufacturing assembly steps that would expose the protection module to additional handling and potential damage. The pre-configured recess protects the sensor during high-temperature lamination.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If actuation sensors are integrated, then anti-skimming protection is enabled, but device complexity increases

Engineering Contradiction:
Improveanti-skimming protectionVSAvoiddevice structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the actuation sensor integration with the existing RFID card manufacturing process by incorporating the sensor into the laminate structure during standard lamination. The recess is formed as part of the laminate layers, and electrical contacts are integrated into the same manufacturing flow. This merging approach adds anti-skimming protection functionality without requiring separate manufacturing processes or significantly increasing device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The laminate layers serve multiple functions: they provide the structural base of the RFID card, contain the electrical contacts for the antenna, and simultaneously house the recess for the actuation sensor. This multi-functionality allows the same manufacturing process to achieve both card construction and sensor integration, reducing overall device complexity while enabling anti-skimming protection.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing costs, enhances the quality of RFID devices by enabling anti-skimming protection and preventing unauthorized data access, while avoiding potential damage to the protection module during high-temperature lamination.

Implementation Method 1

Upon presence of an electromagnetic field emitted by a reader device, the RFID antenna supplies energy from the electromagnetic field to the integrated circuit

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS11295191B2Secure RFID device
Publication Date: 2022.04.05 ASSA ABLOY AB
  • US11295191B2 patent drawing
  • US11295191B2 patent drawing

AI summary

A secure RFID device is provided. The RFID device includes a switch module mounted in a recess of a device body. The switch module includes a switching portion configured to electrically connect terminal ends of an RFID antenna embedded in the switch body. In particular, forming the recess and mounting the switch module including the switching portion to the RFID device after final lamination of the same allows for the use of manufacturing techniques that result in RFID cards having high durability and required ISO qualities.