RFID Tag Self-Destruction for Edge Crack Detection
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Solution Overview
Problem
Traditional methods for detecting edge cracks in dies during the die sawing process are inadequate, especially after the wafer-level packing process, such as tape and reel (TnR), where visual inspection is not feasible.
Innovation Solution
A method utilizing a RFID reader and tag system, where the RFID tag includes a tag antenna and processor disposed under and outside the die's seal ring, respectively, to send and receive command signals, determining the presence of edge cracks by responding or failing to respond, and subsequently self-destructing to avoid impacting the die's operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If visual inspection is used for edge crack detection, then the detection method is simple, but it cannot be realized after wafer-level packing process
Solution Approach 1:
The RFID tag is embedded within the die structure itself, with the tag antenna positioned inside the seal ring and the tag processor under the seal ring. This nesting approach allows the detection function to be integrated into the die, enabling crack detection both before and after packaging processes without requiring external inspection equipment.
Solution Approach 2:
The patent replaces the mechanical visual inspection method with an electromagnetic field-based RFID detection system. The RFID reader communicates with the embedded tag through electromagnetic signals, allowing non-contact detection that works effectively after packaging when visual inspection is no longer feasible.
2Reliability
If RFID tag is used for continuous monitoring, then detection reliability is improved, but the tag may interfere with die operation
Solution Approach 1:
The RFID tag is designed with a self-destruct mechanism that activates when the die passes inspection. The reader sends a destroy command to the tag, causing it to delete its memory contents and stop responding to commands. This eliminates the tag's potential interference with die operation while maintaining its utility for detection purposes during the inspection process.
3Manufacturing precision
If edge crack detection is implemented after packaging, then product quality is ensured, but detection complexity increases
Solution Approach 1:
The RFID tag is embedded in the die during the manufacturing process, before packaging. This preliminary integration of the detection capability allows the system to provide continuous monitoring from manufacturing through packaging and distribution, simplifying the overall detection architecture compared to adding external inspection equipment after packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective detection of edge cracks in dies during the die sawing process, particularly in the tape and reel packing stage, without disrupting normal die operation, and is applicable across various RF bands.
Implementation Method 1
The tag antenna is disposed outside the seal ring of the die. The RFID reader sends a command signal to the RFID tag
Implementation Method 2
the tag antenna and the tag processor encircling the die under test are workable to send a response signal to the RFID reader
Data Source
AI summary
According to an exemplary embodiment, a method of detecting edge cracks in a die under test is provided. The method includes the following operations: receiving a command signal; providing power from the command signal; providing a response signal based on the command signal; and self-destructing based on the command signal.