RFID Tag RFIC Module Simplified Structure
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Solution Overview
Problem
Conventional RFID tags have a complicated structure due to the multilayer laminated RFIC module with interlayer connection conductors, which complicates production and increases the risk of deformation and disconnection.
Innovation Solution
A simpler RFIC module structure is implemented in the RFID tag, featuring a base substrate with an RFIC chip and antenna element connected via direct current or capacitive coupling, with meander-shaped wiring patterns for increased inductance and capacitance, and a protective layer to enhance durability and communication characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multilayer laminated structure with interlayer connection conductors is used in the RFIC module, then the structural integrity and electrical connections are improved, but the device complexity and manufacturing difficulty increase significantly
Solution Approach 1:
The patent merges the RFIC chip and matching circuit into a single integrated RFIC module, eliminating the need for separate interlayer connection conductors between multiple resin sheets. The conductor patterns are formed directly on the resin sheet containing both the RFIC chip mounting area and the matching circuit, thereby reducing structural complexity while maintaining electrical integrity.
Solution Approach 2:
The patent segments the RFID tag into distinct functional modules: the RFIC module (containing RFIC chip and matching circuit), the antenna element, and the resin sheet substrate. This modular segmentation allows each component to be optimized independently while simplifying the overall assembly structure compared to fully integrated multilayer designs.
2Reliability
If multiple resin sheets are laminated with interlayer connection conductors, then the electrical connections between RFIC chip and matching circuit are improved, but the manufacturing precision requirements and production complexity increase
Solution Approach 1:
The patent combines the RFIC chip and matching circuit onto a single resin sheet, eliminating the need for precise lamination and interlayer alignment of multiple sheets. The conductor patterns are formed directly on this single substrate, thereby maintaining electrical connectivity while dramatically reducing manufacturing precision requirements.
3Ease of manufacture
If a simpler RFIC module structure is implemented, then the manufacturing complexity is reduced, but the inductance and capacitance values may be insufficient for proper impedance matching
Solution Approach 1:
The patent employs meander-shaped (curved) conductor patterns for the matching circuit instead of straight lines. This curvature increases the effective length of the conductor traces, thereby providing sufficient inductance and capacitance values for proper impedance matching between the antenna and RFIC chip, while still maintaining a planar single-layer structure that is easy to manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The simplified structure reduces manufacturing complexity, enhances communication stability, and protects the RFIC chip and wiring patterns, while maintaining high rigidity and accuracy in communication characteristics.
Implementation Method 1
a first module-side terminal connected in terms of a direct current, or capacitively coupled, to the first antenna-side terminal of the antenna element, a second module-side terminal connected in terms of a direct current, or capacitively coupled, to the second antenna-side terminal of the antenna element
Data Source
AI summary
An RFID tag is provided that includes an RFIC module with a base substrate and an RFIC chip, and an antenna element. A principal surface of the base substrate is provided with a first chip connection terminal connected to a first input/output terminal of the RFIC chip, a second chip connection terminal connected to a second input/output terminal, a first module-side terminal connected by direct current or capacitively coupled to a first antenna-side terminal of the antenna element, a second module-side terminal connected by direct current or capacitively coupled to a second antenna-side terminal, a first wiring pattern connecting the first chip connection terminal and the first module-side terminal, a second wiring pattern connecting the second chip connection terminal and the second module-side terminal, and a third wiring pattern connecting the first module-side terminal and the second module-side terminal.