RFID Tag Through-Hole Antenna Layout for Wash-Induced Stress
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Solution Overview
Problem
Existing RFID tags experience disconnection and communication performance deterioration due to stress concentration on discontinuous points such as the periphery of the potting and conductive adhesive, leading to unresponsiveness when attached to objects like linen products and washed.
Innovation Solution
The RFID tag design includes a substrate with an IC chip and antenna pattern on opposite faces, using through holes to connect the antenna with the IC chip around the conductive adhesive, and a protective layer to shield the antenna, avoiding stress concentration at these points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the antenna pattern is formed on the same face as the IC chip with conventional connection methods, then the structure is simpler, but stress concentration occurs at discontinuous points like the periphery of conductive adhesive, causing antenna disconnection
Solution Approach 1:
The patent transitions the antenna pattern from the same face as the IC chip to the opposite face (second face) of the substrate. This dimensional change allows the antenna to be positioned away from stress concentration zones around the conductive adhesive, eliminating the reliability issue while maintaining structural simplicity through the through-hole connection method
2Reliability
If the antenna pattern is moved to the opposite face of the substrate, then stress concentration is avoided and reliability is improved, but additional through holes are needed to connect the antenna with the IC chip
Solution Approach 1:
The patent extracts the antenna pattern from the vicinity of the IC chip and conductive adhesive, positioning it on the opposite face of the substrate. This extraction removes the antenna from the stress concentration zone, improving reliability. The through-holes serve as minimal necessary connection elements, providing electrical connectivity without re-introducing stress concentration issues
3Reliability
If through holes are used to connect the antenna pattern on the opposite face with the IC chip, then stress concentration is avoided, but the substrate must be penetrated which may affect mechanical integrity
Solution Approach 1:
The patent uses through-holes as intermediary elements to establish electrical connection between the antenna pattern on the second face and the IC chip on the first face. These through-holes act as conductive mediators that provide necessary electrical connectivity while being positioned to avoid stress concentration zones, thus maintaining both electrical functionality and mechanical integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design suppresses antenna disconnection and maintains communication performance by distributing stress away from the antenna pattern, ensuring reliable RFID tag functionality even under physical stress.
Implementation Method 1
a conductive adhesive that is positioned around the IC chip along the first face and fixes the IC chip to the substrate
Data Source
AI summary
An RFID tag includes a sheet-like substrate, an IC chip disposed on a first face of the substrate, a conductive adhesive that is positioned around the IC chip along the first face and fixes the IC chip to the substrate, an antenna pattern formed on a second face, of the substrate, that is opposite to the first face, and a through hole that penetrates the substrate toward the conductive adhesive around the IC chip and electrically connects the antenna pattern with the IC chip.