RFID Transponder Bare Chip Protection via Carrier Layer Recess
Solution Overview
Problem
RFID transponder products face mechanical stresses during manufacturing and use, which can damage bare chips and their contacts, and existing methods for creating electrically conductive bridges require additional contact material, complicating the construction and increasing costs.
Innovation Solution
A method involving a crossing-free coil-shaped antenna structure with chip and bridge terminals on a non-conductive carrier layer, using flip-chip technology to contact bare chips, and creating a bridge structure with thicker connection terminals on a separate cover layer, which are laminated with insulating layers to form a robust and cost-effective RFID transponder product.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If bare chips are used to reduce product height, then product height is reduced, but chip breakage and contact damage risk increases
Solution Approach 1:
The patent applies beforehand cushioning by introducing a recess in the carrier layer that accommodates the bare chip, creating a protective cavity before the lamination process. This recess cushions the chip against mechanical stresses during manufacturing and use, preventing breakage and contact damage while maintaining the reduced product height advantage of bare chips.
2Reliability
If additional contact material is used to create electrically conductive bridges, then bridge structure reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the bridge structure creation with the lamination process itself. The recess in the carrier layer serves dual purposes: it protects the chip and simultaneously creates the electrically conductive bridge when the layers are laminated together. This eliminates the need for separate bridge-creating steps and additional contact materials, reducing device complexity while maintaining reliability.
Solution Approach 2:
The lamination process itself performs the dual function of joining layers and creating electrically conductive bridges. The recess structure in the carrier layer is designed to automatically form the bridge connection when laminated, making the system self-sufficient without requiring additional materials or processes for bridge creation.
3Ease of manufacture
If mechanical stresses are applied during lamination, then layers are bonded together, but chip and contact damage occurs
Solution Approach 1:
The recess in the carrier layer provides beforehand cushioning that protects the bare chip and its contacts during the lamination process. The cavity absorbs and distributes the mechanical stresses applied during bonding, preventing direct transmission of force to the fragile chip components while still enabling effective layer bonding.
4Reliability
If encapsulated chips are used to protect against mechanical stresses, then chip protection is improved, but product height increases
Solution Approach 1:
Instead of using encapsulated chips that add height, the patent employs beforehand cushioning through a recess in the carrier layer. This recess provides mechanical protection and stress absorption for bare chips without adding significant height, as the protection is achieved through the layer structure itself rather than additional encapsulation material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the robustness of RFID transponder products against mechanical stresses, simplifies the bridge structure creation, and enables productive roll-to-roll manufacturing, resulting in a durable and cost-effective product with improved mechanical resistance.
Implementation Method 1
The carrier layer, compensation layer and cover layer are arranged in relation to one another in such a way that the bare chip is located in the embedding opening of the compensation layer
Implementation Method 2
The carrier layer, compensation layer and cover layer are laminated together
Data Source
Figure 1
Figure 2
AI summary
The invention proposes a method for producing an arrangement which can be processed further to produce a contactless chip card or an identification document, for example, and which has a multilayer structure, wherein a first portion of an RFID antenna, which portion comprises at least one coil-shaped antenna structure and a connecting structure, is arranged on a support layer, and said portion of the antenna structure has the chip mounted directly on it and contact-connected, this has a compensating layer arranged above it which has an embedding opening in the region of the chip and which has at least two plated-through openings in the region in which the first portion of the RFID antenna crosses a bridge structure which is located on a top layer, and as a result of the lamination the individual layers are connected to one another.