RFID Transponder Antenna Etching via Laser Masking

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Solution Overview

Problem

Existing RFID transponder manufacturing methods face challenges in achieving consistent radio frequency performance due to misalignment of RFID chips with respect to antenna elements, leading to variations in impedance and unreliable operation.

Innovation Solution

A method where the RFID chip is attached to a conductive sheet first, and then the antenna elements are formed by etching, allowing for precise positioning and compensation of misalignment, using a laser to process a mask layer and create grooves that define the antenna edges, thereby reducing manufacturing costs and waste.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If antenna elements are produced by chemical etching before chip attachment, then manufacturing process is simplified, but positioning precision of chip contacts with respect to antenna terminals deteriorates

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidpositioning precision of chip contacts

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent inverts the conventional manufacturing sequence by attaching the RFID chip to the conductive sheet first, then forming the antenna elements through laser processing and etching. This reversal allows the antenna elements to be precisely positioned relative to the already-placed chip, solving the positioning precision problem while maintaining manufacturing simplicity

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The chip is attached to the conductive sheet in advance before antenna formation. This preliminary action establishes a fixed reference point that guides subsequent laser processing and etching operations, ensuring accurate positioning of antenna terminals relative to chip contacts

Inventive Principle:

Principle #10Preliminary action

2Productivity

If high power laser beam is used to cut through conductive sheet directly, then processing speed increases, but risk of damaging the chip increases

Engineering Contradiction:

Improveprocessing speedVSAvoidchip damage risk

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The laser processing is segmented into two distinct stages: first, a low-power laser removes the mask layer to create a window; second, a high-power laser etches the conductive sheet through the window to form antenna elements. This segmentation allows high-speed processing while protecting the chip from direct exposure to high-power laser

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The mask layer serves as an intermediary protective layer between the chip and the high-power laser beam. The low-power laser first removes this intermediary to create a controlled window, allowing subsequent high-power laser etching to proceed without directly exposing the chip to harmful laser energy

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in more consistent and reliable RFID transponder performance by ensuring accurate positioning of antenna elements with respect to the chip, reducing manufacturing costs, and minimizing waste, while enabling the production of substrateless transponders for efficient attachment or embedding in items.

Implementation Method 1

processing the mask layer (M1) by a laser beam (LB1) so as to form an exposed portion (U2) of the conductive sheet (70)

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

etching (ETCH1) said exposed portion (U2) so as to form a groove (C2) in the conductive sheet (70)

Methodology Applied

Scientific EffectChemical etching:

Data Source

PatentEP2798582B1A method for producing an RFID transponder by etching

Publication Date: 2017.10.18 SMARTRAC INVESTMENT BV

AI summary

A method for producing a radio frequency identification transponder (100) comprises: - providing a conductive sheet (70) covered by a mask layer (M1, M2), - processing the mask layer (M1 ) by a laser beam (LB1 ) so as to form an exposed portion (U2) of the conductive sheet (70), wherein said processing is carried out after a radio frequency identification chip (50) has been attached to the conductive sheet (70), an - etching (ETCH1 ) said exposed portion (U2) so as to form a groove (C2) in the conductive sheet (70), wherein said groove (C2) defines an edge of an antenna element (10a) of the transponder (100).