RFID Metal Wire Aerial Deposition via Mechanics Substitution
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Solution Overview
Problem
Current methods for manufacturing radio frequency identification (RFID) devices with metal wire aerials are mechanically complex, lack versatility, and struggle with accuracy, particularly for small substrate thicknesses, limiting their environmental benefits and productivity.
Innovation Solution
A continuous processing line apparatus and method that includes a supply unit, chip application, metal wire deposition, and coating, with advanced motion systems and reading mechanisms to ensure high accuracy and efficiency, allowing for the production of copper wire aerials on reduced thickness substrates with improved productivity and recyclability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If copper wire deposition is used to manufacture RFID aerials, then environmental impact is reduced and recyclability increases, but device complexity and mechanical complexity increase
Solution Approach 1:
The patent replaces traditional mechanical wire deposition systems with a printing-based system that uses conductive ink or paste to create aerial patterns. This substitution eliminates complex mechanical wire handling, positioning, and deposition mechanisms while achieving the same functional result of creating conductive aerials on RFID substrates, thereby reducing device complexity while maintaining environmental benefits.
2Ease of manufacture
If traditional wire deposition machines are used, then copper wire aerials can be manufactured, but manufacturing precision and accuracy decrease for small substrate thicknesses
Solution Approach 1:
The printing-based system replaces mechanical wire deposition with a controlled printing process that deposits conductive material directly onto the substrate in precise patterns. This method offers superior positioning accuracy and consistency, especially for thin substrates, as it eliminates the mechanical tolerances and positioning errors inherent in traditional wire deposition machines.
Solution Approach 2:
The patent changes the physical state and deposition method from solid wire to liquid or paste conductive material. This parameter change allows for finer control over the deposition process, enabling precise placement and thickness control of the aerial conductors, which significantly improves manufacturing precision for small substrate thicknesses.
3Ease of manufacture
If traditional wire deposition methods are used, then copper aerials can be produced, but productivity decreases due to mechanical complexity
Solution Approach 1:
The printing system replaces slow, mechanically complex wire deposition with a high-speed printing process that can deposit entire aerial patterns in a single pass. This substitution dramatically increases production speed and throughput while maintaining the ability to produce copper-based conductive aerials, thereby resolving the productivity bottleneck.
Solution Approach 2:
The printing process enables continuous deposition of conductive material across the entire aerial pattern in one continuous operation, eliminating the sequential wire laying and positioning steps required in traditional methods. This continuity of action significantly boosts productivity while maintaining manufacturing capability.
Data Source
AI summary
A device configured for making a wire aerial of an element of radio frequency identification (RFID), which device comprises:a main body, extending along a longitudinal direction and having a longitudinal seat adapted to house a wire;a putting-wire head arranged at one end of the main body and constrained to the main body,the putting-wire head comprising:a guide element adapted to engage the wire and to deposit it onto a substrate, and which guide wire has a translational degree of freedom along the longitudinal direction with respect to the main body; anda wire-restraining element adapted to selectively abut on the guide element,wherein the putting-wire head is adapted to assume a first rest configuration,wherein the restraining element is abutted onto the guide element and the wire is retained between the restraining element and the guide element, and a second operative configuration.