RFID Tag Assembly via Wire Bonding Through Substrate
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Solution Overview
Problem
Conventional RFID tag assembly methods are costly and time-consuming due to the need for high-precision alignment and the use of conductive adhesives, especially for high-frequency RFID tags with multilayer antennas, which increases the overall cost and reduces assembly throughput.
Innovation Solution
The use of wire bonding techniques to connect RFID integrated circuits (ICs) to antennas through openings in a substrate, allowing for the assembly of RFID tags using a single metal layer and enabling roll-to-roll manufacturing, thereby reducing handling costs and speeding up the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flip chip method with metal bumps and conductive adhesives is used to connect IC to antenna, then connection reliability is improved, but assembly throughput is reduced and handling cost increases
Solution Approach 1:
The patent extracts and eliminates the conductive adhesive material from the connection process. Instead of using flip chip method with metal bumps requiring adhesive bonding, the invention uses wire bonding technique where wires are directly bonded to connect the IC to the antenna terminals, removing the need for adhesive materials and their associated curing processes.
Solution Approach 2:
The patent replaces the mechanical adhesive bonding system with a wire bonding system. The connection is achieved through wire bonding technology where wires are mechanically and electrically connected to the IC pads and antenna terminals through a substrate opening, eliminating the need for thermal and pressure curing processes required by conductive adhesives.
2Reliability
If multilayer process with vias and bridging metal layer is used to prepare loop antenna, then antenna connection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts and removes the complex multilayer antenna fabrication process including vias and bridging metal layers. Instead of creating a multilayer antenna structure, the invention uses a single-layer antenna design where the antenna trace is formed on a single substrate layer, and connections are achieved through wire bonding across a substrate opening rather than through vias and multiple metal layers.
Solution Approach 2:
The patent inverts the conventional approach by instead of creating complex vertical connections through multilayer structures and vias, it uses a wire bonding technique that creates direct connections through a substrate opening. The connection path is inverted from a planar multilayer approach to a vertical wire bonding approach through the substrate, simplifying the antenna layer structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the handling costs and accelerates the RFID tag assembly process by using wire bonding to connect ICs to antennas, allowing for efficient production of RFID tags that can operate in multiple frequency bands with reduced material and processing expenses.
Implementation Method 1
connecting the RFID die to the antenna through wire bonding
Data Source
AI summary
Embodiments are directed to assembling an RFID tag through wire bonding techniques. In some examples, the RFID tag may be assembled by wire bonding of an RFID integrated circuit (IC) to an antenna through a hole in a substrate. In other examples, methods for assembling RFID tags from a singulated IC or diced ICs still on a dicing frame may be disclosed. The disclosed methods may use a single metal layer for producing RFID tags with multi-turn loop antenna.