RFID Wire Deposition Head for Precision Copper Aerials
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Solution Overview
Problem
Current methods for constructing radio frequency identification (RFID) devices with metal wire aerials are mechanically complex, lack versatility, and struggle with accuracy, particularly when working with small substrate thicknesses, limiting the environmental benefits of copper wire technology due to inefficient production processes and stringent waste management regulations.
Innovation Solution
A head device with a main body and a putting-wire head that includes a guide element and a restraining element, allowing for precise deposition of metal wire aerials on substrates with improved motion systems and cutting mechanisms, enabling efficient and accurate processing of copper wire RFID devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If copper wire deposition is used to create RFID aerials, then environmental impact is reduced and recyclability increases, but manufacturing complexity and device weight increase
Solution Approach 1:
The patent replaces traditional mechanical deposition systems with a robotic system that uses controlled movement and positioning mechanisms. The robotic device with multiple arms and grippers substitutes complex mechanical deposition apparatus, simplifying the overall manufacturing system while maintaining precision copper wire placement capability
Solution Approach 2:
The manufacturing system is divided into modular functional units: substrate handling module, copper wire deposition module, and quality control module. This segmentation allows each component to be optimized independently, reducing overall manufacturing complexity while preserving the environmental benefits of copper wire technology
2Manufacturing precision
If traditional deposition machines are used, then copper wire aerials can be produced, but accuracy and precision deteriorate due to mechanical complexity and large dimensions
Solution Approach 1:
Traditional large-scale mechanical deposition machines are replaced with a compact robotic system featuring programmable motion control. The robotic arms with precise positioning capabilities and controlled movement mechanisms achieve higher deposition accuracy without the mechanical complexity and large dimensions of conventional machines
Solution Approach 2:
The system employs dynamic motion control where robotic arms adjust their movement in real-time based on feedback from sensors and pre-programmed trajectories. This dynamic approach enables precise copper wire placement on substrates of varying sizes and configurations, achieving high manufacturing precision through controlled motion rather than fixed mechanical structures
3Quantity of substance
If copper wire technology is adopted, then eco-friendly materials usage increases, but productivity and efficiency decrease due to process limitations
Solution Approach 1:
The robotic system enables continuous production cycles where substrates are processed sequentially without interruption. The automated substrate handling, copper wire deposition, and quality control operations occur in a continuous flow, eliminating idle time and maximizing productivity while maintaining the use of eco-friendly copper wire materials
Solution Approach 2:
The system incorporates automated quality control sensors and feedback mechanisms that enable self-adjustment during production. The robotic device can detect and correct deposition parameters in real-time, and the quality control module automatically identifies defects, reducing the need for manual intervention and maintaining high production efficiency with eco-friendly materials
Data Source
AI summary
An apparatus (1) for the creation of products incorporating devices for radio frequency identification (RFID), said apparatus (1) being configured to operate according to a continuous processing line which includes, in sequence:a supply unit (2) of a substrate material;an add-chip unit (4), having means for the application of chips on the substrate material (41);an aerial-making assembly comprising:an aerial posing unit (5), configured to deposit a metal wire at each chip;an electrical connection unit, configured for electrically connecting the metal wire and a respective chip therebetween;a coupling unit (7), adapted to place a coating material on the substrate material; anda plurality of reading means (42, 62, 9) of each chip, arranged along said processing line,wherein said unit of aerial posing (5) comprises a plurality of devices (100) for realizing an aerial,wherein each device (100) is provided with a putting wire head (150) arranged at one end of a main body (101) and having a translational degree of freedom in a longitudinal direction (L),said putting wire head (150) comprising a guide element (102) rotatable according said longitudinal direction (L) and adapted to engage and guide the wire to deposit it on a substrate and a beak-like element (103) adapted to selectively abut in abutment on said rotatable element.