RGA Interposer With Embedded Heaters for High-Speed I/O
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Solution Overview
Problem
Current interconnect topologies in high-performance servers are limited in bandwidth and unsuitable for speeds greater than 50 GHz due to the use of linear edge connectors and coaxial cables, which restrict the placement of high-speed interconnects and require costly repeaters to meet high-speed I/O requirements.
Innovation Solution
The implementation of a reflowable grid array (RGA) interposer with flexible high-speed I/O cables that can attach to a grid array between the CPU package and the interposer or under it, allowing for multiple channels of I/O and enabling selective heating for solder reflow at any point during assembly or in the field, providing greater design flexibility and scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a linear edge connector (LEC) is used to connect the CPU substrate to the motherboard, then the connection is simple and cost-effective, but the bandwidth is limited and speeds greater than 50 GHz cannot be achieved
Solution Approach 1:
An interposer substrate is introduced as an intermediary component between the CPU package and the motherboard. This interposer provides a grid array of pads that enables high-speed signal routing without the limitations of linear edge connectors. The interposer acts as a mediator that transforms the connection topology from edge-based to grid-based, allowing signals to reach speeds of 50 GHz or greater while maintaining a manageable system architecture.
Solution Approach 2:
The connection interface transitions from a one-dimensional linear edge connector to a two-dimensional grid array of pads on the interposer substrate. This dimensional change allows for significantly increased bandwidth and signal speed capabilities by providing multiple parallel signal paths across the grid, enabling speeds of 50 GHz or greater that were not achievable with linear edge connectors.
2Loss of energy
If high-speed interconnects are positioned close to the CPU, then signal loss is reduced, but the placement is limited by the socketing strategy and requires costly repeaters
Solution Approach 1:
The interposer substrate serves as an intermediary that enables high-speed interconnects to be positioned optimally close to the CPU package without being constrained by traditional socketing strategies. The interposer provides a grid array of pads that can be strategically placed to minimize signal routing traces and reduce signal loss, eliminating the need for costly repeaters while maintaining signal integrity at high speeds.
Solution Approach 2:
The interposer substrate enables local optimization of signal routing by providing a grid array of pads that can be strategically positioned close to the CPU package. This local quality improvement allows for minimized signal routing traces in critical areas, reducing signal loss without requiring system-wide changes or additional repeaters.
3Quantity of substance
If a linear edge connector is used at the edge of the CPU substrate, then the implementation is straightforward, but the number of connections is limited resulting in suboptimal bandwidth
Solution Approach 1:
The connector architecture transitions from a one-dimensional linear edge connector to a two-dimensional grid array of pads on the interposer substrate. This dimensional transformation dramatically increases the number of available connection points from a limited edge perimeter to an extensive grid pattern, enabling significantly higher bandwidth while maintaining a manageable and standardized connector architecture.
Solution Approach 2:
The grid array of pads on the interposer substrate provides universal connectivity that can support multiple channels of I/O simultaneously. This multi-functional pad array can be configured to support various connection scenarios and bandwidth requirements, providing greater versatility and connection capacity compared to the specialized linear edge connector.
4Adaptability or versatility
If the connector is coupled to the edge of the CPU substrate, then the assembly is simple, but the scalability beyond current demands is limited
Solution Approach 1:
The interposer substrate with its two-dimensional grid array of pads provides scalable connectivity that can accommodate current and future demands. The grid architecture allows for easy expansion and reconfiguration of connection patterns without requiring fundamental changes to the basic interposer structure, enabling scalability beyond current requirements while maintaining a relatively simple and standardized architecture.
Solution Approach 2:
The grid array of pads on the interposer substrate provides dynamic reconfigurability, allowing connection patterns to be adapted and reconfigured for different applications and bandwidth requirements. This dynamic capability enables the system to scale and adapt to future demands without requiring a complete redesign of the interposer architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution supports speeds of 50 GHz or greater, offers an inexpensive higher performing HSIO interface connection system, and allows for late attachment and reconfiguration of cables, enhancing system design flexibility and scalability beyond current demands.
Implementation Method 1
a plurality of heating elements embedded in the interposer substrate
Data Source
AI summary
Embodiments include interposers for use in high speed applications. In an embodiment, the interposer comprises an interposer substrate, and an array of pads on a first surface of the interposer substrate. In an embodiment, a plurality of vias pass through the interposer substrate, where each via is electrically coupled to one of the pads in the array of pads. In an embodiment a plurality of heating elements are embedded in the interposer substrate. In an embodiment a first cable is over the first surface interposer substrate. In an embodiment, the first cable comprises an array of conductive lines along the first cable, where conductive lines proximate to a first end of the cable are electrically coupled to pads in the array of pads.