RGB Semiconductor Laser Mount Layout for Compact Bonding

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Solution Overview

Problem

Existing light emitting devices with multiple semiconductor laser elements on a single mount member face challenges in optimizing wiring patterns and bonding methods, which affect size reduction, light condensation, and mounting efficiency.

Innovation Solution

A light emitting device configuration with three semiconductor laser elements emitting red, green, and blue colors, each mounted on a separate conduction part with aligned metal films, allowing for improved bondability and even current distribution, and utilizing a submount with specific metal film arrangements to adjust light emission positions and enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If multiple semiconductor laser elements are mounted on one mount member, then device size is reduced and light condensation is improved, but wiring pattern optimization and bonding method improvement are still needed

Engineering Contradiction:

Improvedevice sizeVSAvoidwiring pattern and bonding method

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent divides the mount member into multiple conduction parts, with each conduction part having separate metal films for mounting individual semiconductor laser elements. This segmentation allows independent wiring patterns and bonding methods for each element, resolving the contradiction by enabling customized manufacturing approaches for each segment while maintaining compact overall structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies different metal film configurations to different conduction parts based on local requirements. Each conduction part can have optimized metal film arrangements, thicknesses, and patterns tailored to specific bonding needs and current distribution requirements, allowing local optimization without compromising the overall compact design.

Inventive Principle:

Principle #3Local quality

2Illumination intensity

If multiple semiconductor laser elements are mounted on one mount member, then light condensation is improved, but wiring pattern and bonding method optimization is needed

Engineering Contradiction:

Improvelight condensationVSAvoidwiring pattern and bonding method

Core Design Contradiction:

Illumination intensityVSEase of manufacture

Solution Approach 1:

By segmenting the mount member into distinct conduction parts with separate metal films, the patent enables independent optimization of wiring patterns for each light-emitting element. This allows precise control of current distribution to each element, improving light condensation while simplifying the manufacturing process through modular wiring approaches.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent incorporates metal films in advance on the conduction parts before mounting the semiconductor laser elements. This preliminary action of pre-configuring the electrical connection structure simplifies the subsequent bonding process and allows for optimized wiring patterns that enhance light condensation without complicating manufacturing.

Inventive Principle:

Principle #10Preliminary action

3Strength

If semiconductor laser elements are mounted on conduction parts with metal films, then bond strength is enhanced, but manufacturing complexity increases

Engineering Contradiction:

Improvebond strengthVSAvoidmounting structure

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent segments the electrical connection structure into multiple conduction parts, each with its own metal films. This segmentation actually reduces overall complexity by allowing each conduction part to be independently manufactured and optimized, while the modular nature simplifies assembly and enhances bond strength through dedicated bonding interfaces.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The conduction parts with metal films serve multiple functions: they provide electrical connection, enhance bond strength, and facilitate heat dissipation. This multi-functionality reduces the need for separate components, thereby reducing overall device complexity while achieving enhanced bond strength.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Manufacturing precision

If conduction parts with aligned metal films are used, then current distribution is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvecurrent distributionVSAvoidalignment precision

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

By segmenting the electrical connection into separate conduction parts with individual metal films, the patent allows each part to be manufactured with standard precision. The aligned arrangement of metal films across conduction parts achieves improved current distribution without requiring ultra-high precision manufacturing, as each segment can be independently controlled.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS11784461B2Light emitting device

Publication Date: 2023.10.10 NICHIA CORP

AI summary

A light emitting device includes first to third semiconductor laser elements. Each of the semiconductor laser elements includes at least two emitters, and configured to emit red-color light, green-color light, or blue-color light. The mount member includes first to third conduction parts, each including a plurality of metal films including mounting regions that are aligned in a predetermined direction. The first to third semiconductor laser elements are respectively mounted on the first to third conduction parts of the mount member in a junction-down configuration.