RGB Light-Emitting Module Layout for Interactive Display Sensing
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Solution Overview
Problem
Current light-emitting diode (LED) modules for display applications lack integrated sensing functions and interaction capabilities, limiting their ability to effectively display information and interact with the external environment.
Innovation Solution
A compact light-emitting module structure featuring a circuit substrate with conductive channels and pads, incorporating red, green, and blue LED chips arranged in a matrix, along with an electric component and a translucent encapsulating component, which also includes an orientation indicator and improved heat dissipation, enabling enhanced light emission and interaction capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If LEDs are assembled as full color pixel units by combining red, green, and blue LED chips, then the display capability is improved, but the device complexity increases due to the need for multiple chips and precise arrangement
Solution Approach 1:
The patent combines multiple LED chips (red, green, blue) and control circuits into an integrated pixel unit structure. The circuit substrate integrates multiple conductive channels and pads that simultaneously connect to multiple LED chips, merging what would otherwise be separate components into a unified modular pixel unit that maintains display capability while reducing overall system complexity
Solution Approach 2:
The circuit substrate serves multiple functions simultaneously: it provides mechanical support for mounting LED chips, conducts electrical signals through multiple channels to different chips, and enables independent control of each LED chip. This multi-functional design allows a single component to replace what would otherwise require multiple separate components, thereby reducing device complexity while maintaining full display capability
2Area of stationary object
If a compact light-emitting module structure is adopted with multiple LED chips arranged in matrix, then the area efficiency is improved, but the heat dissipation becomes more difficult due to closer proximity of heat-generating components
Solution Approach 1:
The circuit substrate is divided into multiple independent conductive channels and conductive pads that are spatially separated and independently routed. This segmentation allows heat generated by each LED chip to be conducted away through separate thermal paths, preventing heat accumulation even though the chips are arranged in a compact matrix configuration
3Device complexity
If electric components are integrated on the same substrate as LED chips, then the device complexity is reduced, but the reliability decreases due to potential interference between different components
Solution Approach 1:
Different regions of the circuit substrate are designed with different local characteristics: some areas are optimized for electrical signal transmission with specific conductive channel configurations, while other areas are designed for heat dissipation with appropriate thermal pathways. The conductive pads are strategically positioned to provide both electrical connection and thermal management, with each local region optimized for its specific function to minimize interference between components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, efficient, and interactive light-emitting module that can effectively display information and sense its environment, with improved heat dissipation and orientation indication, enhancing the functionality of display apparatuses.
Implementation Method 1
Each of the light-emitting groups includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip
Implementation Method 2
LEDs are able to emit monochromatic light so that they can be assembled as a full color pixel unit
Implementation Method 3
A translucent encapsulating component covers the plurality of light-emitting groups and the electric component
Data Source
AI summary
The present disclosure provides a light-emitting module and a display apparatus thereof. The light-emitting module includes a circuit substrate which includes a first surface and a second surface opposite to the first surface. The first surface includes a plurality of conductive channels, and the second surface includes a plurality of conductive pads. A plurality of light-emitting groups is arranged in a matrix on the first surface. Each of the light-emitting groups includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. An electric component is disposed on the first surface and located in the light-emitting groups matrix. A translucent encapsulating component covers the plurality of light-emitting groups and the electric component. Wherein, the light-emitting groups matrix comprises m columns and n rows.