Rhombic Pin Fin Semiconductor Module Cooling
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Solution Overview
Problem
Existing semiconductor modules have low efficiency in transferring heat generated by semiconductor devices to a coolant passing through cooling fins, leading to inadequate heat dissipation.
Innovation Solution
A semiconductor module design featuring a coolant flow portion with a substantially rectangular cross-section and rhombic-shaped cooling pin fins, where the pin fins are more densely packed along the shorter sides, and the coolant flow direction is orthogonal to the semiconductor chip arrangement, enhancing heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional cooling fins are used with coolant flow parallel to fin arrangement, then the cooling structure is simple, but heat transfer efficiency is low due to high coolant flow velocity loss
Solution Approach 1:
The cooling pin fins are arranged asymmetrically in the coolant flow portion, with a greater number of pin fins along the longer sides compared to the shorter sides. This asymmetric arrangement optimizes the coolant flow path and reduces flow velocity loss, thereby improving heat transfer efficiency without significantly complicating the manufacturing process.
Solution Approach 2:
The density of cooling pin fins is varied locally within the coolant flow portion. Specifically, the pin fins are more densely packed along the longer sides where heat transfer requirements are higher, and less densely packed along the shorter sides. This local variation in fin density optimizes heat transfer efficiency while managing coolant flow characteristics.
2Temperature
If cooling fins are arranged to maximize heat transfer area, then heat dissipation capability increases, but coolant flow resistance increases leading to velocity loss
Solution Approach 1:
The asymmetric arrangement of cooling pin fins creates an optimized flow path that balances heat transfer area with flow resistance. The greater density of pin fins along the longer sides maximizes heat transfer where needed, while the configuration along the shorter sides maintains lower flow resistance, preserving coolant velocity.
Solution Approach 2:
The invention changes the geometric parameters of the cooling fin arrangement, specifically the density distribution and orientation of pin fins. By adjusting these parameters asymmetrically, the system achieves optimal balance between heat transfer surface area and coolant flow velocity, reducing energy loss while maintaining effective cooling.
3Reliability
If uniform cooling is achieved across semiconductor chips, then thermal performance improves, but coolant flow path complexity increases
Solution Approach 1:
The asymmetric pin fin arrangement naturally guides coolant flow to distribute heat more uniformly across the semiconductor chips. The varying density of pin fins along different sides creates optimized flow distribution patterns that achieve uniform cooling without requiring complex flow path configurations or additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves heat dissipation efficiency by reducing coolant flow velocity loss and ensuring uniform cooling of semiconductor chips, thereby enhancing the thermal performance of the semiconductor module.
Implementation Method 1
heat generated by the plurality of semiconductor devices to a coolant passing close to the cooling fins
Implementation Method 2
coolant flow portion for causing a coolant to flow defined by the top plate, the side wall and the bottom plate
Data Source
AI summary
A semiconductor module comprises a semiconductor apparatus and a cooling apparatus. The semiconductor apparatus includes a semiconductor chip and a circuit board. The cooling apparatus includes: a top plate; a side wall; a bottom plate; a coolant flow portion for causing a coolant to flow defined by the plates and the wall, where a cross section of the portion parallel to a principal surface of the top plate have a substantially rectangular shape with longer sides and shorter sides; an inlet associated with one direction along the shorter sides for letting a coolant into the portion; an outlet associated with another direction along the shorter sides for letting a coolant out of the portion; and a cooling pin fin arranged in the portion, extending between the top plate and the bottom plate, and having a substantially rhombic shape longer along the shorter sides than along the longer sides.