Ribbed Semiconductor Package Lid for CTE Stress and Warpage
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Solution Overview
Problem
The coefficient of thermal expansion (CTE) mismatch between materials used in semiconductor devices and substrates leads to thermal stress, causing die crack or delamination issues in semiconductor packages.
Innovation Solution
A semiconductor package design featuring a lid structure with rib portions protruded towards the package structure, which improves warpage and reduces delamination, and includes a thermal interface layer for enhanced thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a lid structure is added to improve thermal performance and reduce warpage, then thermal management and mechanical stability are improved, but device complexity increases
Solution Approach 1:
The lid structure is segmented into a main body and multiple rib portions that extend toward the package structure. This segmentation allows the lid to provide thermal management functionality while the ribs specifically address warpage issues, dividing the complex function into manageable structural elements
Solution Approach 2:
The rib portions extend in a dimensional direction toward the package structure from the main body of the lid. This dimensional extension provides mechanical support and thermal pathways without requiring a completely separate support structure, managing complexity through spatial arrangement
2Adaptability or versatility
If materials with different CTE are used to achieve functional requirements, then device functionality is improved, but thermal stress and delamination increase
Solution Approach 1:
The lid structure incorporates rib portions with specific local geometric properties that extend toward the package structure. These localized structural features provide differential mechanical support and thermal management in different regions, accommodating CTE mismatches between materials while reducing overall thermal stress
Solution Approach 2:
The package structure employs a composite construction with the lid structure having different material properties than the package structure beneath it. The rib portions act as transition zones that manage the interface between materials with different CTE, reducing delamination risk while maintaining material selection flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces thermal stress and delamination, enhancing the mechanical reliability and thermal performance of semiconductor packages by addressing CTE mismatch and warpage issues.
Implementation Method 1
a thermal interface layer for enhanced thermal performance
Implementation Method 2
The coefficient of thermal expansion (CTE) mismatch between materials used in semiconductor devices and substrates leads to thermal stress
Data Source
AI summary
A semiconductor package includes a substrate, a package structure, and a lid structure. The package structure is disposed on the substrate. The lid structure is disposed over substrate, wherein the lid structure includes a main body covering and surrounding the package structure and a plurality of rib portions protruded from the main body and extended toward the package structure.