Ultrasonic Ribbon Bonding Workholder with Segmented Standoffs
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Solution Overview
Problem
Current ultrasonic bonding systems for solar substrates face challenges in providing efficient and reliable interconnections, particularly in minimizing substrate bending and preventing cracking during the bonding process, which affects the quality and efficiency of ribbon bonding operations.
Innovation Solution
The development of advanced workholders with standoffs and a ribbon bonding system that includes a bond head assembly and XY assembly, utilizing a ribbon guide and a bond head assembly that can move vertically and rotationally, along with a method of using negative fluid pressure to secure the substrate, allowing for precise and efficient bonding of ribbons to solar substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding systems are used, then bonding operation can be performed, but substrate bending occurs and cracking risk increases
Solution Approach 1:
The workholder is divided into multiple segments including a body portion, a clamp portion, and multiple standoffs. This segmentation allows each component to perform its specific function: the body provides structural support, the clamp secures the substrate, and the standoffs provide localized support points to prevent bending during bonding operations.
Solution Approach 2:
Standoffs are strategically positioned at specific locations on the workholder to provide localized support where needed. This local quality approach ensures that substrate bending is prevented at critical bonding zones without requiring uniform support across the entire substrate surface, thereby reducing cracking risk while maintaining bonding quality.
2Manufacturing precision
If workholder with standoffs is used, then substrate bending is minimized, but device complexity increases
Solution Approach 1:
The workholder design merges multiple functions into a single integrated component: the body portion provides structural support, the clamp portion secures the substrate, and the standoffs provide positioning support. This merging eliminates the need for separate positioning fixtures and clamping devices, reducing overall device complexity while maintaining manufacturing precision.
Solution Approach 2:
The workholder is designed as a multi-functional device that can accommodate different substrate types and bonding configurations. The adjustable clamp portion and strategically positioned standoffs allow the same workholder to be used for various bonding operations, reducing the need for multiple specialized fixtures and thereby reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the precision and efficiency of ribbon bonding by minimizing substrate bending, reducing the risk of cracking, and ensuring high-quality interconnections between solar substrates, thereby improving the overall ultrasonic bonding process.
Implementation Method 1
The upper terminal end of a bonding tool is, in many instances, configured to be engaged in a transducer (e.g., an ultrasonic transducer) of a ribbon bonding system which causes the bonding tool to vibrate upon bonding
Implementation Method 2
a method of using negative fluid pressure to secure the substrate
Data Source
AI summary
An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation.