Metal Ribbon EMI Shielding for Semiconductor Packages
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Solution Overview
Problem
Existing semiconductor device shielding solutions against electromagnetic interference are complex, costly, and increase device dimensions, which contradicts the trend of miniaturization, especially in portable electronic devices.
Innovation Solution
A shielding structure is created by bonding metal ribbon sections to the die, which are then connected to a grid structure on the support, forming an electromagnetic cage, using standard packaging processes without the need for additional external metal regions or thickening the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conductive shielding layer is applied on the packaging mass using sputtering, plating, or growth techniques, then electromagnetic interference shielding is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent uses inexpensive metal ribbons instead of expensive sputtering or plating processes. The metal ribbons are bonded to the packaging mass using simple adhesive techniques, eliminating the need for complex microelectronic deposition equipment and reducing manufacturing costs while achieving the same EMI shielding effect
Solution Approach 2:
The patent replaces the mechanical/chemical deposition processes (sputtering, plating, growth) with a simpler mechanical bonding approach using adhesive. This substitution eliminates complex equipment requirements and reduces manufacturing complexity while maintaining the conductive shielding function
2Object-affected harmful factors
If a conductive shielding layer is applied on the packaging mass, then electromagnetic interference shielding is achieved, but manufacturing cost increases
Solution Approach 1:
The patent uses inexpensive metal ribbons instead of expensive sputtering or plating processes. The metal ribbons are bonded to the packaging mass using simple adhesive techniques, eliminating the need for complex microelectronic deposition equipment and reducing manufacturing costs while achieving the same EMI shielding effect
3Object-affected harmful factors
If shielding structures are added to packaged devices, then electromagnetic interference protection is improved, but device dimensions increase
Solution Approach 1:
The patent integrates the metal ribbon shielding structures within the existing packaging mass volume, nesting the shielding function inside the package rather than adding external shielding layers. This allows the shielding to be accommodated within the existing device footprint without increasing overall dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and maintains device miniaturization by integrating the shielding within the package without increasing dimensions, making it suitable for portable and complex electronic systems.
Implementation Method 1
A simple known shielding structure consists in providing a cap of conductive material, typically metal, over the die for forming a sort of Faraday's cage
Implementation Method 2
The ribbon sections are bonded to supports, for example a supporting board that also carries one or more dice to be packaged
Data Source
AI summary
A packaged device has a die of semiconductor material bonded to a support. An electromagnetic shielding structure surrounds the die and is formed by a grid structure of conductive material extending into the support and an electromagnetic shield, coupled together. A packaging mass embeds both the die and the electromagnetic shield. The electromagnetic shield is formed by a plurality of metal ribbon sections overlying the die and embedded in the packaging mass. Each metal ribbon section has a thickness-to-width ratio between approximately 1:2 and approximately 1:50.