Ribbon Wire Bond Assembly for 3D PCB Component Mounting
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Solution Overview
Problem
Existing substrate mounting technologies are inefficient in managing the space required for larger electrical components, which occupy disproportionately large areas on printed circuit boards (PCBs) and lead frames, limiting the area available for smaller components.
Innovation Solution
The use of ribbon wire bonds with open ends and central portions allows larger electrical components to be mounted above the substrate surface, reducing the surface area needed for these components and enabling additional components to be placed beneath them, using techniques such as soldering, welding, or conductive epoxy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If larger electrical components are mounted directly on the substrate surface, then the components can be easily connected and assembled, but the surface area occupied by these components increases, limiting the area available for smaller components
Solution Approach 1:
The patent applies dimensionality change by mounting larger electrical components in the third dimension (vertically above the substrate) rather than in the traditional two-dimensional plane. Components are attached to the central portion of ribbon wire bonds that extend upward from the substrate surface, transforming a surface area problem into a volumetric solution. This allows smaller components to be placed in the previously occupied substrate area while maintaining electrical connectivity through the vertical wire bond structure.
2Area of stationary object
If larger electrical components are mounted above the substrate surface using ribbon wire bonds, then the surface area required for these components is reduced, but the device structure becomes more complex
Solution Approach 1:
The ribbon wire bond structure serves multiple functions simultaneously: it provides electrical connectivity between the substrate and the elevated component, acts as a mechanical support structure for the component, and creates the vertical positioning necessary for three-dimensional mounting. This multi-functionality reduces the need for separate connection elements, support structures, and positioning fixtures that would otherwise be required, thereby limiting the increase in device complexity despite the elevated component arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the surface area required for larger components on PCBs and lead frames, allowing for more efficient use of space and enabling the mounting of smaller components beneath them, thereby optimizing the substrate area.
Implementation Method 1
using techniques such as soldering, welding, or conductive epoxy
Implementation Method 2
using techniques such as soldering, welding, or conductive epoxy
Implementation Method 3
using techniques such as soldering, welding, or conductive epoxy
Data Source
AI summary
In a described example, an electrical apparatus includes a substrate having a first surface and lead pads on the first surface of the substrate for surface mounting components. A ribbon wire bond is provided having open ends and a central portion between the open ends, the open ends of the ribbon wire bond connected to the lead pads. An electrical component is bonded to the central portion of the ribbon wire bond. The central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate.