Ribbon Wire Wedge Bonding for Low-Resistance Battery Interconnects
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Solution Overview
Problem
Existing bond wire interconnections in electrical device assemblies, such as battery modules, introduce unwanted electrical resistance, necessitating approaches to reduce this resistance and improve electrical conductivity.
Innovation Solution
The use of a ribbon wire with multiple-direction wedge wire bonds, where the ribbon wire is electrically coupled to multiple electrical contact surfaces, including a busbar and electrochemical cell terminals, using a continuous bond wire to reduce resistance and improve conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional bond wire interconnections are used to connect electrical contact surfaces, then the assembly can be manufactured with simple wiring, but unwanted electrical resistance is introduced and conductivity is reduced
Solution Approach 1:
The patent transitions from traditional linear wire bonding to multi-directional wedge wire bonding, where the wire bonder head moves in multiple directions (first direction to bond first and second contact surfaces, second direction to bond third contact surface) to create a three-dimensional interconnection pattern. This dimensional change reduces electrical resistance by creating shorter, more direct electrical pathways between contact surfaces.
Solution Approach 2:
The wire bonder head is made dynamically adjustable, capable of rotating and changing direction during the bonding process. The system can switch between first and second directions of travel, and adjust the angle of the wire bonds, allowing optimization of electrical pathways dynamically during manufacturing to minimize resistance while maintaining manufacturing flexibility.
2Reliability
If multiple separate wire bonds are used to connect multiple electrical contact surfaces, then each connection can be optimized independently, but the device complexity and number of components increases
Solution Approach 1:
The patent combines multiple wire bonding operations into a single continuous process using one wire bonder head. The same bonder head performs bonding in both first and second directions, and can bond multiple contact surfaces (first, second, and third electrical contact surfaces) without requiring separate bonding equipment or operations, thereby reducing device complexity while maintaining connection quality.
Solution Approach 2:
The wire bonder head is designed with universal functionality to perform multiple bonding operations: it can bond in different directions, connect to different types of electrical contact surfaces, and adjust its orientation. This multi-functional capability eliminates the need for multiple specialized bonding devices, reducing overall system complexity while ensuring reliable electrical connections.
Data Source
AI summary
In a general aspect, an electrical device assembly (e.g., a battery module) can include first, second and third electrical contact surface. The first and second electrical contact surfaces can be spaced from the third electrical contact surface in a common direction. The assembly can include a ribbon wire electrically coupling the first electrical contact surface with each of the second electrical contact surface and the third electrical contact surface. A first end of the ribbon wire can be wedge bonded to the first electrical contact surface with a first wedge wire bond, a second end of the ribbon wire can be wedge bonded to the second electrical contact surface with a second wedge wire bond, and a portion of the ribbon wire that is intermediate between the first and second ends can be wedge bonded to the third electrical contact surface with a third wedge wire bond.