Ridged Integrated Heat Spreader Warpage Mitigation
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Solution Overview
Problem
The increasing complexity and size of integrated circuit devices lead to warpage in integrated heat spreaders, causing thermal interface material to migrate and create voids, which degrades heat dissipation capability and increases operating temperatures.
Innovation Solution
A top side ridged perimeter on the integrated heat spreader is designed to prevent thermal interface material migration by forming a barrier that retains the material even under warpage, ensuring continuous thermal contact with the heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the integrated circuit package size increases to accommodate larger dies and more socket contacts, then the device complexity and processing capability improve, but the warpage of the integrated heat spreader increases
Solution Approach 1:
The top surface of the IHS is segmented into a central region and a peripheral region with a ridge structure. This segmentation allows the peripheral region to be elevated above the central region, creating a barrier that prevents TIM migration while maintaining overall structural integrity despite warpage forces.
Solution Approach 2:
The solution introduces a vertical dimension by creating a ridge that elevates the peripheral region above the central region. This dimensional change creates a physical barrier that addresses the TIM migration problem caused by warpage without requiring changes to the horizontal layout.
2Strength
If downward forces are applied to secure the package into the socket and attach the heat sink, then the mechanical stability improves, but the TIM migrates outward creating voids
Solution Approach 1:
The ridge structure is pre-formed on the IHS before assembly, creating a preliminary barrier that counteracts the outward migration force of the TIM. This preliminary anti-action prevents TIM from migrating to the edges under downward loading forces during socket insertion and heat sink attachment.
3Temperature
If TIM is applied to provide thermal contact and adhesion, then the heat dissipation efficiency improves, but the TIM flows outward under warpage creating empty voids
Solution Approach 1:
The IHS surface is given different local qualities: the central region provides a flat thermal contact surface, while the peripheral region is elevated to form a ridge. This local quality difference creates a containment structure that keeps TIM in the central region where it is needed for thermal contact, preventing it from flowing to the edges where it creates voids.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ridged perimeter effectively prevents thermal interface material migration, maintaining thermal contact and reducing voids, thereby enhancing heat dissipation and minimizing temperature increases in integrated circuit devices.
Implementation Method 1
an integrated heat spreader (IHS) is placed above an integrated circuit die to provide a low thermal resistance path between the integrated circuit die and a component level heat dissipation device
Implementation Method 2
A layer of TIM is also placed between the integrated circuit die and the IHS
Data Source
AI summary
An integrated circuit package is presented. In an embodiment, the integrated circuit package has a package substrate, an integrated circuit die attached to the package substrate, and a package level heat dissipation device, such as an integrated heat spreader, attached to the package substrate encapsulating the integrated circuit die. The package level heat dissipation device has a top side with a ridge formed on top of a perimeter of the top side, and a bottom side that couples to the integrated circuit die.