Rifted Conductor Layout for Uniform Current Sensor Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current sensor systems are sensitive to placement errors and manufacturing tolerances, leading to non-uniform magnetic coupling and the need for post-manufacturing calibration, which can compromise accuracy and reliability.
Innovation Solution
A conductor design with a rift formed by aligned through-holes in multiple conductive layers, encapsulated by dielectric material, ensures a uniform magnetic coupling coefficient, reducing sensitivity to placement errors and eliminating the need for post-manufacturing calibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional solid conductive layers are used without through-holes, then the conductor structure is simple and easy to manufacture, but the magnetic coupling coefficient becomes non-uniform and sensitive to placement errors
Solution Approach 1:
The conductive layers are segmented by introducing through-holes that extend through the entire thickness of the conductor. These holes create a rift structure that divides the solid conductive material into separate regions, allowing the magnetic field to couple more uniformly through the conductor layers. This segmentation transforms the homogeneous solid structure into a controlled heterogeneous structure with improved magnetic coupling characteristics.
Solution Approach 2:
The through-holes are strategically positioned at specific locations within the conductive layers to create local variations in the conductor structure. By placing holes at critical positions where magnetic coupling needs improvement, the design achieves non-uniform structural modifications that result in overall uniform magnetic coupling. The local structural changes are targeted to address specific coupling issues without requiring complete structural redesign.
2Reliability
If conventional conductive layers without rifts are used, then the device structure is simpler, but post-manufacturing calibration is required to correct placement errors
Solution Approach 1:
The rift structure with through-holes is built into the conductor during the manufacturing process, before the sensor assembly and calibration stages. This preliminary structural preparation ensures that the magnetic coupling is optimized in advance, eliminating the need for subsequent calibration procedures to correct placement errors. The structure is pre-configured to be tolerant of manufacturing variations, so no additional calibration steps are required afterward.
3Manufacturing precision
If through-holes of different sizes are used in different layers, then magnetic coupling uniformity is improved, but the manufacturing process becomes more complex
Solution Approach 1:
Different sized through-holes are implemented in different conductive layers based on the specific magnetic coupling requirements of each layer. The hole sizes are locally optimized to match the varying magnetic field distribution and coupling needs at different depths within the conductor structure. This local optimization approach achieves superior overall uniformity by addressing the specific requirements of each layer rather than applying a uniform hole size throughout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The rifted conductor design enhances magnetic coupling uniformity, improving accuracy and reducing sensitivity to placement errors, thereby enhancing the reliability and precision of current measurements.
Implementation Method 1
the rift is arranged to cause an area directly above the rift to have a substantially uniform magnetic coupling coefficient
Data Source
AI summary
An apparatus, including: one or more first conductive layers; a plurality of second conductive layers that are electrically coupled to the first conductive layers, the first conductive layers and the second conductive layers being arranged to form a conductor, the first conductive layers being arranged to define a rift in the conductor, the rift being formed by using a plurality of through-holes that are situated above or below each other, each of the plurality of through-holes being formed in a different one of the second conductive layers, each of the plurality of through-holes being formed directly above or below a solid portion of at least one of the first conductive layers; and a dielectric material that is arranged to encapsulate, at least in part, the first conductive layers and the second conductive layers.