Right Angle Backplane Connector for High-Speed Memory

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Solution Overview

Problem

Current memory interconnect arrangements face challenges in achieving high data transfer speed and signal integrity, particularly with vertically extending memory boards and edge connectors, which do not provide sufficient space for multiple DIMMs per channel, leading to routing limitations and inadequate performance in applications requiring high data transfer rates like 1866 mega transfers per second.

Innovation Solution

The proposed solution involves a motherboard configuration with a right angle backplane connector system, where memory cards are plugged into memory board slot type connectors on a perpendicular memory card printed circuit board, allowing for shorter trace lengths and connector lengths, enabling the fitting of 32 DIMM slots and 4 BGA2011 CPU sockets in a 2U tall rack space, and maximizing signal integrity through optimized connector design and ground plane plates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If a vertically extending memory board printed circuit board is plugged into an edge card connector, then the surface space occupied by CPUs and memory cards is reduced, but the data transfer speed and signal integrity are insufficient for high-performance applications

Engineering Contradiction:
Improvesurface spaceVSAvoidsignal integrity
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent transitions from a planar edge connector layout to a three-dimensional right angle backplane connector configuration. The memory card printed circuit board is positioned perpendicular to the motherboard, with the right angle connector enabling vertical signal routing that then turns 90 degrees to reach the CPU. This dimensional change allows high-speed signals to travel shorter distances through optimized vertical pathways rather than long horizontal traces across the board edge.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Quantity of substance

If multiple DIMMs are stacked vertically on a memory card printed circuit board, then the quantity of memory per channel is increased, but the routing limitations and board real estate constraints prevent sufficient room for multiple DIMMs per channel with quad socket implementation

Engineering Contradiction:
Improvenumber of DIMMsVSAvoidrouting limitations
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The right angle backplane connector configuration reorganizes the spatial arrangement of memory components. By positioning the memory card printed circuit board perpendicular to the motherboard and using vertical stacking of DIMMs, the design maximizes the use of vertical space rather than horizontal space. This allows 32 DIMM slots to be accommodated in a 2U rack space, effectively doubling the memory capacity per channel while simplifying the routing architecture through standardized vertical connections.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If the connector length is reduced to improve signal integrity, then the data transfer speed is improved, but the physical space requirements and manufacturing constraints are affected

Engineering Contradiction:
Improvesignal integrityVSAvoidconnector length
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent optimizes the right angle backplane connector by carefully controlling the length of the vertical signal traces and the 90-degree transition section. The connector is designed with specific trace length parameters that minimize signal degradation while maintaining manufacturability. The vertical routing allows for shorter effective signal paths compared to horizontal edge connector implementations, and the right angle configuration enables precise control over trace lengths to achieve optimal signal integrity for high-speed memory interfaces.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS8747132B1Printed circuit board injector/ejector mechanism
Publication Date: 2014.06.10 EMC IP HLDG CO LLC
  • US8747132B1 patent drawing
  • US8747132B1 patent drawing
  • US8747132B1 patent drawing

AI summary

An arrangement having a processor electrically to, and mounted on, a portion of a surface of a motherboard. A plurality of memory cards is plugged into memory board slot type connectors on a surface of the memory card printed circuit board with the surface of the memory card printed circuit board being perpendicular to the surface of the motherboard. A right angle backplane connector has a first end disposed perpendicular to, and electrically connected to the surface of a motherboard and a second end disposed on the surface of, and electrically connected to, the memory card printed circuit board. The plurality of memory cards is parallel to the surface of the motherboard. An injector/ejector mechanism is provided for removing the memory printed circuit board from an electrical connector receptacle mounted to the motherboard by camming action.