Right Angle Coaxial Connector Inductive Soldering PIM Reduction
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Solution Overview
Problem
Coaxial cable connectors often experience Passive Intermodulation Distortion (PIM) due to less than symmetrical interconnections and mechanical stress, which degrades the electrical performance of RF systems, and existing solutions are costly and inefficient in reducing PIM.
Innovation Solution
A method of soldering the inner conductor of a coaxial cable to a right angle coaxial connector using a blind hole or receptacle with an inductive soldering process, ensuring a secure and symmetrical connection that minimizes PIM by maintaining the solder within the blind hole and allowing controlled outgassing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional coaxial cable connectors are used with asymmetrical interconnections, then manufacturing is simpler and cost is lower, but Passive Intermodulation Distortion (PIM) increases and electrical performance degrades
Solution Approach 1:
The patent applies asymmetry by designing a right-angle connector where the inner conductor is positioned asymmetrically within the connector body, creating a symmetrical interconnection when mated. This asymmetrical design within the connector achieves symmetrical overall interconnection, reducing PIM while maintaining manufacturing feasibility
Solution Approach 2:
The patent transitions from traditional in-line connectors to right-angle connectors, changing the spatial dimension of connection. The inner conductor connects perpendicular to the outer conductor, creating a right-angle geometry that achieves symmetrical interconnection and reduces PIM while maintaining manufacturing simplicity
2Reliability
If inductive soldering process is used to create symmetrical solder joints, then PIM is reduced and electrical performance is maintained, but manufacturing complexity and process time increase
Solution Approach 1:
The patent replaces traditional mechanical soldering methods with inductive soldering, using electromagnetic induction to heat and melt solder. This substitution enables precise thermal control for symmetrical solder joints while maintaining manufacturing efficiency through automated induction heating processes
Solution Approach 2:
The patent controls soldering parameters including temperature, heating time, and induction power to achieve symmetrical solder joints. By optimizing these parameters, the process creates consistent high-quality joints that reduce PIM while maintaining productive manufacturing speeds
3Reliability
If blind hole design is used to contain solder, then symmetrical connection is achieved and PIM is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates the blind hole design into the connector manufacturing process beforehand, pre-positioning the blind hole at the correct location and orientation. This preliminary action ensures that during assembly, the inner conductor automatically aligns with the blind hole, achieving symmetrical connection without requiring high precision during final assembly
Solution Approach 2:
The blind hole acts as an intermediary structure that guides and contains the solder, ensuring symmetrical distribution of solder material. This intermediary design simplifies the positioning requirements by providing a physical constraint that automatically achieves symmetrical joint formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces PIM by creating a reliable and symmetrical solder joint that maintains electrical performance and is cost-effective by using an inductive soldering process to secure the inner conductor within the connector, thereby enhancing the overall connectivity of RF systems.
Implementation Method 1
heating the blind hole of the inner conductor to melt solder present in the blind hole
Implementation Method 2
melt solder present in the blind hole to form a solder joint
Data Source
AI summary
A method of induction soldering an inner conductor of a coaxial cable to an inner contact of a right angle coaxial connector includes: (a) providing a coaxial connector, the coaxial connector including an outer conductor body and an inner contact, the inner contact defining a mating axis, the inner contact further comprising a blind hole with an open end; (b) providing a coaxial cable, the coaxial cable including an inner conductor, a dielectric circumferentially surrounding the inner conductor, and an outer conductor circumferentially surrounding the dielectric; (c) inserting the coaxial cable into the coaxial connector such that an end of the inner conductor is positioned in the blind hole of the inner contact and perpendicular to the mating axis; and (d) heating the blind hole of the inner conductor to melt solder present in the blind hole to form a solder joint between the inner conductor and the inner contact.