Right-Angle Optoelectronic Chip Carrier for Perpendicular Mounting
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Solution Overview
Problem
Traditional optoelectronic chip carriers restrict the mounting of top or bottom emitting/detecting opto-electronic devices to a parallel orientation with the circuit board, limiting the optical axis alignment and requiring non-conventional packaging for compact, efficient interconnect modules.
Innovation Solution
The development of right-angle optoelectronic chip carriers that allow for the perpendicular mounting of opto-electronic die and associated components, enabling a direct optical interface with ancillary components like lenses, and providing conductive signal paths for efficient electrical connectivity, facilitating compact and efficient optoelectronic interconnect modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional parallel mounting is used, then ease of manufacture is improved, but device compactness and optical axis alignment deteriorate
Solution Approach 1:
The patent transitions from traditional parallel mounting (2D planar arrangement) to perpendicular mounting by introducing a third dimension. The optoelectronic die is mounted at a right angle to the circuit board, allowing the optical axis to be perpendicular to the board surface while the die surface remains parallel to it. This dimensional change enables compact module design without sacrificing manufacturing feasibility.
2Ease of manufacture
If traditional parallel mounting is used, then ease of manufacture is improved, but optical axis alignment deteriorates
Solution Approach 1:
The invention resolves the alignment contradiction by changing the mounting orientation to perpendicular. The die surface is maintained parallel to the circuit board while the die itself is oriented at 90 degrees, allowing the optical axis to align perpendicularly with the board. This geometric reconfiguration achieves precise optical alignment while preserving standard manufacturing processes.
Solution Approach 2:
The patent employs asymmetric mounting geometry where the optoelectronic die is positioned at a right angle rather than parallel to the circuit board. This asymmetric orientation creates distinct functional surfaces: the die surface remains parallel to the board for manufacturing compatibility, while the optical axis becomes perpendicular for optimal alignment, resolving the contradiction between ease of manufacture and alignment precision.
3Volume of moving object
If right angle mounting is used, then device compactness is improved, but device complexity increases
Solution Approach 1:
The patent achieves compactness by utilizing the third dimension for perpendicular mounting. The carrier structure incorporates a right-angle geometry that allows the optoelectronic die to be mounted vertically relative to the circuit board, significantly reducing the module's footprint while maintaining straightforward structural design and assembly procedures.
4Productivity
If perpendicular mounting is used, then optical interconnect efficiency is improved, but traditional packaging compatibility deteriorates
Solution Approach 1:
The invention achieves perpendicular mounting while preserving packaging compatibility through careful geometric design. The carrier structure is configured so that the die surface remains parallel to the circuit board, allowing standard packaging and assembly techniques to be used, while the die's perpendicular orientation enables efficient optical interconnects with improved productivity.
Data Source
AI summary
Carriers enabling multichip driving of optoelectronic interconnects are disclosed. In one instance, the carriers provide a substantially perpendicular interface between the host circuit board and the optoelectronic die.