Rigid Auxiliary Carrier for Semiconductor Singulation
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Solution Overview
Problem
Existing methods for singulating semiconductor components, such as optoelectronic semiconductor chips, face challenges with flexible carriers that are not suitable for high chemical or thermal loading capacities, limiting their effectiveness in production processes.
Innovation Solution
A method involving a rigid auxiliary carrier with a metallic connection and laser detachment for singulating semiconductor components, allowing for selective removal and forming side faces using a plasma method, which enhances thermal and chemical stability and flexibility in geometry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a flexible film is used as carrier for semiconductor wafers, then the carrier can be easily handled and applied, but it cannot withstand high chemical loading capacity and high thermal loading capacity (250°C or more)
Solution Approach 1:
The patent introduces a rigid auxiliary carrier as an intermediary substrate that replaces the flexible film for processes requiring high thermal and chemical stability. The semiconductor wafer is transferred from the flexible film to the rigid auxiliary carrier, which then serves as the temporary carrier during singulation and other harsh processes. This intermediary carrier withstands the harsh conditions while the flexible film retains its ease of handling benefits during initial stages.
Solution Approach 2:
The patent changes the physical parameters of the carrier by switching from a flexible film with low thermal and chemical resistance to a rigid auxiliary carrier with high thermal and chemical stability. This parameter change enables the system to withstand temperatures of 250°C or more and high chemical loading capacities during singulation and etching processes.
2Reliability
If a rigid auxiliary carrier is used instead of a flexible film, then thermal stability and chemical stability are improved, but the flexibility and ease of handling are reduced
Solution Approach 1:
The patent segments the carrier function into two distinct stages: first, the flexible film serves as the initial carrier for wafer placement and handling; second, the rigid auxiliary carrier takes over for processes requiring thermal and chemical stability. This segmentation allows each carrier type to optimize its strengths for specific process stages.
Solution Approach 2:
The rigid auxiliary carrier acts as an intermediary between the flexible film and the final singulated components. It provides the necessary stability during harsh processes while being temporarily introduced into the system, then discarded after serving its purpose.
3Device complexity
If conventional singulation methods are used with flexible carriers, then the process is simple, but the singulation reliability is insufficient under high thermal and chemical loading
Solution Approach 1:
The rigid auxiliary carrier serves as a mediator that enables reliable singulation under high thermal and chemical loading conditions. It provides a stable platform for the semiconductor wafer during laser separation and etching processes, ensuring precise and reliable singulation that would not be achievable with flexible films under the same conditions.
Solution Approach 2:
The patent changes the carrier material parameters to withstand the extreme conditions of advanced singulation processes. The rigid auxiliary carrier's high thermal conductivity and chemical inertness enable the use of high-power laser separation and aggressive etching chemicals, significantly improving singulation reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable and improved singulation with high thermal and chemical stability, allowing for selective removal and varied geometry of semiconductor components, reducing the risk of fracture and improving mechanical stability.
Implementation Method 1
the rigid auxiliary carrier can be distinguished by a high thermal stability and/or a high chemical stability with respect to etching processes
Implementation Method 2
This can be effected for example by means of soldering, eutectic bonding, joining by means of isothermal solidification (transient liquid phase bonding) or by means of a thermo compression method
Implementation Method 3
This can be effected for example by means of soldering, eutectic bonding, joining by means of isothermal solidification (transient liquid phase bonding) or by means of a thermo compression method
Implementation Method 4
The component regions are removed from the auxiliary carrier preferably by means of a laser detachment method (laser lift-off)
Implementation Method 5
before the removal of the component regions from the auxiliary carrier, side faces of the component regions are formed by means of a plasma method
Data Source
AI summary
A method relates to separating a component composite into a plurality of component regions, wherein the component composite is provided having a semiconductor layer sequence comprising a region for generating or for receiving electromagnetic radiation. The component composite is mounted on a rigid subcarrier. The component composite is separated into the plurality of component regions, wherein one semiconductor body is produced from the semiconductor layer sequence for each component region. The component regions are removed from the subcarrier.