Rigid Encapsulation Unit for Flat Displays
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Solution Overview
Problem
Flat display apparatuses are prone to deformation and damage due to heat, leading to weakened rigidity and potential disbanding along the sealing unit, especially when external forces are applied, as thermal residual stress causes peel stress.
Innovation Solution
Incorporating a complex member with a metal layer and carbon fibers, which has a lower thermal expansion rate than the substrate, and forming convex portions or ribs on the encapsulation unit to increase its surface area and moment of inertia without increasing thickness, thereby enhancing the rigidity of the encapsulation unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thick lower substrate or thick encapsulation substrate is formed to prevent heat damage, then thermal resistance is improved, but device weight increases and rigidity is weakened due to thermal residual stress
Solution Approach 1:
The patent applies composite materials by combining a resin matrix with carbon fibers to form a complex member. This composite structure provides both thermal resistance and mechanical strength while maintaining low weight, resolving the contradiction between thermal protection and weight reduction.
Solution Approach 2:
The patent introduces a convex portion that protrudes from the encapsulation substrate in the vertical dimension. This three-dimensional structure increases the surface moment of inertia, enhancing rigidity and resistance to thermal residual stress without increasing the planar footprint or weight of the device.
2Temperature
If a thick encapsulation substrate is used to prevent heat damage, then thermal protection is improved, but rigidity is weakened and disbanding occurs along the sealing unit due to peel stress
Solution Approach 1:
The complex member uses a composite of resin matrix and carbon fibers, where the carbon fibers provide high tensile strength and rigidity. This composite structure prevents disbanding along the sealing unit while maintaining thermal protection, resolving the contradiction between thermal protection and rigidity.
Solution Approach 2:
The convex portion protruding from the encapsulation substrate increases the surface moment of inertia, which significantly enhances bending resistance and rigidity. This dimensional change allows the encapsulation unit to resist peel stress from thermal residual stress without requiring increased substrate thickness.
3Strength
If the encapsulation unit rigidity is increased to prevent bending, then structural strength is improved, but device thickness increases
Solution Approach 1:
Instead of increasing thickness uniformly, the patent introduces a convex portion that protrudes locally from the encapsulation substrate. This creates a three-dimensional structure that increases the surface moment of inertia and enhances rigidity without significantly increasing the overall device thickness.
Solution Approach 2:
The reinforcement is applied locally through the convex portion rather than uniformly across the entire encapsulation substrate. This localized approach enhances rigidity where needed while maintaining the thin profile of the overall device, resolving the contradiction between rigidity and thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases the rigidity of the encapsulation unit, preventing bending and maintaining durability even under thermal expansion, while allowing for the inclusion of a getter to prevent contact between the encapsulation and display units.
Implementation Method 1
Incorporating a complex member with a metal layer and carbon fibers in the encapsulation unit, featuring convex portions and ribs, which increases the surface moment of inertia without adding thickness or weight, thereby enhancing the rigidity of the encapsulation unit and preventing bending
Implementation Method 2
Portable flat display apparatuses, such as organic light emitting and liquid crystal displays, are prone to deformation and damage due to thermal residual stress
Data Source
AI summary
A display apparatus including: a display unit disposed on a substrate; an encapsulation unit facing the display unit, the encapsulation unit including: a metal layer; a complex member; and a reinforcement member formed on an upper surface of the complex member; and a sealing unit disposed between the substrate and the encapsulation unit and apart from the display unit to bond the substrate and the encapsulation unit to the sealing unit.