Rigid-Flex Circuit Board Interface for Impedance-Matched Signal Links
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Solution Overview
Problem
Current electronic package components, such as connectors and cables, are limited by structural defects and impedance mismatches, leading to high reflection loss and reduced transmission speed, making it difficult to achieve true high-speed signal transmission.
Innovation Solution
A circuit board design featuring a rigid board body with conductive and dielectric layers forming a bendable extension portion and connecting members, where the extension portion replaces cables and the connecting end replaces connectors, with shielding members to reduce signal interference, ensuring characteristic impedance matching and minimizing reflection loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional connectors and cables are used in electronic packages, then the device complexity is reduced and ease of manufacture is improved, but the transmission speed decreases and reflection loss increases due to structural defects and impedance mismatches
Solution Approach 1:
The patent merges the functions of cables and connectors into an integrated circuit board structure. The extension portion with connecting members eliminates the need for separate cable and connector components, reducing device complexity while achieving impedance matching for high-speed transmission
Solution Approach 2:
The patent changes the structural parameters of the circuit board by extending conductive layers and dielectric layers to form an extension portion. This structural parameter change enables characteristic impedance matching, reducing reflection loss and enabling high-speed transmission without conventional connectors
2Reliability
If conventional connectors and cables are used in electronic packages, then the device complexity is reduced and ease of manufacture is improved, but the transmission performance deteriorates due to high reflection loss and characteristic impedance mismatch
Solution Approach 1:
The patent merges the functions of cables and connectors into an integrated circuit board structure. The extension portion with connecting members eliminates the need for separate cable and connector components, reducing device complexity while achieving impedance matching for high-speed transmission
Solution Approach 2:
The patent applies local quality by designing the extension portion with specific conductive and dielectric layer configurations at the connecting end. This localized structural optimization achieves characteristic impedance matching exactly where needed (at the connecting end), improving transmission performance without increasing overall device complexity
Data Source
AI summary
A circuit board and an electronic package using the same are provided. The circuit board includes a rigid board body, at least one bendable extension portion, connecting members, and shielding members. The rigid board body includes conductive layers and dielectric layers therebetween. The extension portion is connected to a side of the rigid board body and formed by layers of the conductive layers and at least one layer of the dielectric layers extending outside the rigid board body. The connecting members are arranged on a connecting end of the extension portion and electrically connected to a signal layer of the conductive layers. The shielding members are arranged around the corresponding connecting members and electrically connected to a ground layer of the conductive layers. The connecting members and the shielding members protrude from the connecting end. A height of the shielding members is lower than a height of the connecting members.