Rigid-Flex Component Carrier Embedding for Thermal Stress Stability

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Solution Overview

Problem

Flexible component carriers face challenges in providing a mechanically stable environment for embedded electronic components due to thermal stress from differing thermal expansion coefficients, which can lead to reliability issues during manufacturing and operation.

Innovation Solution

A component carrier with two rigid regions connected via a flexible region, utilizing a stack of electrically insulating and conductive layer structures, including a flexible gap filling material and adhesive base layer to securely embed components within blind openings, allowing for mechanical stability and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electronic components are embedded in flexible component carriers, then flexibility is achieved, but mechanical stability deteriorates due to thermal stress from different thermal expansion coefficients

Engineering Contradiction:

ImproveflexibilityVSAvoidmechanical stability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The component carrier is divided into multiple layers with different properties: a flexible substrate layer providing adaptability, and additional layers (conductive, insulating, adhesive) that provide mechanical stability and stress distribution. This segmentation allows each layer to perform its specific function without compromising the overall structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs a composite structure consisting of multiple material layers including flexible substrate material, conductive material, insulating material, and adhesive material. This composite approach combines the advantages of flexibility from the substrate with the mechanical stability and stress distribution properties of the additional layers, resolving the contradiction between flexibility and mechanical stability.

Inventive Principle:

Principle #40Composite materials

2Reliability

If electronic components are embedded in rigid component carriers, then mechanical stability is improved, but flexibility deteriorates

Engineering Contradiction:

Improvemechanical stabilityVSAvoidflexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The component carrier structure provides different local properties: the flexible substrate layer provides flexibility where needed, while the additional layers provide rigidity and stability in specific regions. The adhesive material specifically at the component interface provides localized mechanical stability without compromising overall flexibility.

Inventive Principle:

Principle #3Local quality

3Reliability

If adhesive material is used to attach embedded components, then mechanical stability is improved, but thermal stress from different thermal expansion coefficients worsens reliability

Engineering Contradiction:

Improvemechanical stabilityVSAvoidthermal stress

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The adhesive material acts as an intermediary layer between the electronic component and the component carrier structure. This intermediate layer accommodates thermal expansion differences between materials, distributing and reducing thermal stress while maintaining mechanical attachment and stability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables the creation of a rigid-flex component carrier that maintains mechanical stability and flexibility, enhancing operational reliability and suitability for various applications, including wearable electronics.

Implementation Method 1

an adhesive base layer to securely embed components within blind openings

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

a flexible gap filling material and adhesive base layer to securely embed components

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentEP3481162B1Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portions

Publication Date: 2023.09.06 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

Figure 1a~2a
Figure 2b~2e
Figure 2f~4

AI summary

It is described a component carrier (200, 300, 400) comprising (a) a first component carrier portion (110a, 110b) having a blind opening (116a); (b) a component (250, 350, 450) arranged in the blind opening (116a); and (c) a second component carrier portion (230, 330, 430) at least partially filling the blind opening (116a). At least one of the first component carrier portion (110a, 110b) and the second component carrier portion (230, 330, 430) comprises a flexible component carrier material, and the first component carrier portion (110a, 110b) and the second component carrier portion (230, 330, 430) form a stack of a plurality of electrically insulating layer structures (114, 116) and/or electrically conductive layer structures (112, 119, 118). It is further described a method for manufacturing such a component carrier (200, 300, 400).