Rigid-Flex Connected Board Grounding via Direct Conductive Layer Contact
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Solution Overview
Problem
Existing display devices face limitations in grounding performance due to the use of conductive adhesive components, which can lead to increased electrical resistance and structural complexity, affecting the reliability of sensors and overall device functionality.
Innovation Solution
A connected board configuration that directly connects two circuit boards with a rigid-flexible structure, where a conductive layer is sandwiched between hard substrates for rigidity and soft substrates for flexibility, eliminating the need for conductive adhesive components and enhancing grounding without increasing electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive adhesive components are used for grounding, then grounding connection is achieved, but electrical resistance increases and grounding performance deteriorates
Solution Approach 1:
The patent removes the conductive adhesive component from the grounding path entirely. The second circuit board is directly mounted on the conductive layer of the first circuit board, eliminating the intermediate conductive adhesive layer that caused increased electrical resistance and grounding performance deterioration.
Solution Approach 2:
The patent merges the grounding functions by directly connecting the conductive layer of the first circuit board with the second circuit board through direct mounting. This eliminates separate grounding components and creates a unified low-resistance grounding path.
2Reliability
If conductive adhesive components are used for grounding, then grounding connection is achieved, but structural complexity increases
Solution Approach 1:
The patent extracts and removes the conductive adhesive component from the grounding structure. This simplification eliminates the need for additional materials, attachment processes, and potential failure points associated with conductive adhesives.
Solution Approach 2:
The patent combines the mounting and grounding functions into a single direct mounting operation. The second circuit board serves both as a structural component and a grounding element, eliminating the need for separate grounding components and reducing overall structural complexity.
3Ease of manufacture
If rigid-flexible circuit board with holes in mounting areas is used, then component mounting is enabled, but grounding performance decreases
Solution Approach 1:
The patent applies local quality by concentrating the grounding function in the conductive layer beneath the second circuit board rather than relying on continuous grounding surfaces. The holes in the rigid portion do not affect grounding because the conductive layer provides localized grounding paths where needed.
Solution Approach 2:
The conductive layer acts as an intermediary that provides grounding functionality even when the rigid portion has holes for component mounting. This intermediate conductive layer bridges the grounding needs with the mechanical requirements of component installation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes and enhances grounding performance, reducing the likelihood of malfunctions and allowing for a more compact design with increased component mountable areas, while simplifying the structure and reducing the need for special mounting tools.
Implementation Method 1
The second ground is directly connected to the conductive layer of the first circuit board
Data Source
AI summary
A connected board includes a first circuit board including a first ground and a second circuit board including a second ground. The first circuit board includes a rigid portion and a flexible portion. The rigid portion includes a section of a conductive layer having flexibility and hard substrates prepared from an insulator and having rigidity. The section of the conductive layer is bonded to the hard substrates and held by the hard substrates. The flexible portion includes a section of the conductive layer extending from the rigid portion and a soft substrate covering the section. The soft substrate includes a connection hole for connecting the second circuit board to the first circuit board. The second circuit board is mounted to the flexible portion in the connection hole. The second ground is directly connected to the conductive layer of the first circuit board.