Rigid-Flex Electrode Circuit Stress Distribution

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Solution Overview

Problem

Existing electrode systems for testing Evoked Response Potentials (ERPs) lack a robust and flexible configuration that can efficiently distribute physical stress, leading to potential structural and electronic failures during use.

Innovation Solution

The electrode system employs a rigid-flex circuit design where a single, unitary flexible circuit substrate is shared among electrode modules, providing structural and electrical integrity by distributing physical stresses along the circuit substrate rather than concentrating them at solder joints or plug-in connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional electrode systems are used with separate circuit boards and solder joints, then assembly is straightforward, but structural and electronic failures occur under physical stress

Engineering Contradiction:

Improvestructural and electrical integrityVSAvoidcircuit configuration

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges rigid and flexible circuit boards into a single rigid-flex circuit substrate that provides both structural support and electrical connectivity. This integration eliminates separate solder joints and connections between discrete circuit boards, creating a unified structure that maintains reliability under physical stress while reducing assembly complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent employs a composite rigid-flex circuit substrate that combines rigid and flexible material properties in a single structure. This composite design allows the circuit to withstand physical stress and deformation while maintaining electrical integrity, resolving the contradiction between reliability and structural simplicity

Inventive Principle:

Principle #40Composite materials

2Reliability

If rigid circuit boards are used for electrode modules, then electrical connections are stable, but physical stress concentrates at solder joints causing failure

Engineering Contradiction:

Improveelectrical connection stabilityVSAvoidresistance to physical stress

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent incorporates flexible circuit regions within the rigid-flex substrate that can bend and deform to distribute physical stress away from critical electrical connections. This flexibility prevents stress concentration at solder joints while maintaining stable electrical connections, resolving the contradiction between connection stability and stress resistance

Inventive Principle:

Principle #30Flexible shells and thin films

3Strength

If flexible circuit substrates are used alone, then stress is distributed, but structural integrity and electrical stability are insufficient

Engineering Contradiction:

Improvestress distributionVSAvoidelectrical integrity

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The rigid-flex circuit substrate combines rigid regions for structural integrity and electrical stability with flexible regions for stress distribution. This composite structure allows the circuit to simultaneously maintain electrical integrity while distributing physical stress, resolving the contradiction between strength and reliability

Inventive Principle:

Principle #40Composite materials

4Adaptability or versatility

If multiple separate circuit boards are used for different electrode modules, then modularity is achieved, but assembly complexity and potential connection failures increase

Engineering Contradiction:

Improvemodule configurationVSAvoidassembly and connection structure

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent integrates multiple electrode module circuits into a single rigid-flex circuit substrate, eliminating the need for separate circuit boards and interconnections. This merging maintains the functional modularity of electrode modules while simplifying the overall assembly and eliminating connection points that could fail, resolving the contradiction between adaptability and assembly complexity

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS9072448B2Electrode system with rigid-flex circuit

Publication Date: 2015.07.07 NEURONETRIX SOLUTIONS LLC

AI summary

An electrode system comprises a flexible circuit substrate, a plurality of electrode modules, and a plurality of sensors. The flexible circuit substrate comprises a flexible material and traces supported by the flexible material. The flexible circuit substrate extends through at least two of the electrode modules such that the electrode modules encompass portions of the flexible circuit substrate. Each electrode module comprises at least one rigid circuit member configured to process ERPs of a test subject. The rigid circuit members are layered against the flexible circuit substrate such that the rigid circuit members and the flexible circuit substrate together form a rigid-flex circuit. The sensors may be removably coupled with at least one of the plurality of electrode modules and may sense ERPs from the test subject.