Liquid Discharge Apparatus With Rigid-Flex Heat-Sink Layout
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing liquid discharge apparatuses face challenges in size reduction, improved discharge accuracy, and productivity enhancement, despite advancements in increasing the number of nozzles and discharge amount per unit time.
Innovation Solution
A liquid discharge apparatus with a print head and substrate unit featuring a piezoelectric element, a rigid-flexible substrate with specific lamination of rigid members and a flexible member, and integrated heat sinks for thermal management, along with abnormality notification sections to ensure reliable operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a plurality of heads with large number of nozzles is used to increase discharge amount per unit time, then productivity is improved, but device size increases
Solution Approach 1:
The substrate unit is inserted into the housing from the rear side, with the connector unit positioned to overlap with the housing in the width direction. This nesting arrangement allows multiple functional components to occupy overlapping spatial footprints, reducing the overall device width while accommodating multiple heads and cooling mechanisms.
Solution Approach 2:
The connector unit extends in the width direction beyond the housing boundary, utilizing the third dimension (width) to route connections without increasing the front-to-back depth. This dimensional redistribution allows high-density nozzle configurations without proportionally increasing overall device volume.
2Productivity
If drive circuits are integrated to increase nozzle count, then productivity is improved, but heat generation increases
Solution Approach 1:
Heat sinks are positioned between the drive circuits and the housing to intercept and dissipate heat before it accumulates in the housing. The heat sinks act as thermal intermediaries, conducting heat away from the dense circuitry and transferring it to the surrounding air, thereby maintaining operational temperatures despite high power consumption from multiple nozzles.
Solution Approach 2:
Cooling holes are selectively formed only in specific regions of the housing where heat sinks are positioned, concentrating cooling efforts in high-heat-generation zones rather than uniformly cooling the entire structure. This localized cooling approach efficiently manages thermal hotspots from drive circuits while minimizing overall housing complexity.
3Ease of operation
If substrate unit is made flexible for easy installation, then ease of operation is improved, but structural stability deteriorates
Solution Approach 1:
The substrate unit is constructed as a flexible printed circuit board that can be bent and folded to navigate around internal components during installation. This flexible substrate maintains electrical connectivity while accommodating the compact, multi-layered housing structure, enabling easy integration without rigid mounting requirements.
Solution Approach 2:
The flexible substrate unit is inserted into and nested within the housing structure, with its flexible nature allowing it to conform to the available space. The substrate's flexibility enables it to be routed through tight spaces and positioned precisely without requiring large installation clearances, while maintaining structural integrity once installed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances discharge accuracy, reduces size, and improves productivity by stabilizing piezoelectric element driving and providing real-time abnormality detection, thereby optimizing the liquid discharge process.
Implementation Method 1
a discharge section that has a piezoelectric element that is displaced by receiving a driving signal and discharges a liquid by displacement of the piezoelectric element
Implementation Method 2
a first heat sink and a second heat sink which are coupled to the wiring substrate
Data Source
AI summary
There is provided a liquid discharge apparatus, in which a substrate unit includes a first abnormality notification section that notifies an abnormality of the substrate unit, a wiring substrate having a plurality of rigid members and a flexible member, a first heat sink, and a second heat sink, the first heat sink is laminated on the second surface of the first region and positioned close to the second rigid member, the second heat sink is laminated on the second surface of the second region and positioned close to the fourth rigid member, and the first abnormality notification section is provided on a fourth rigid member.


