Rigid-Flex Board Image Sensor Module Cost Reduction
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Solution Overview
Problem
The high cost of ceramic substrates and the need for anisotropic conductive adhesive films in image sensor modules increase the overall cost of image sensor and camera modules, making them less economical for assembly into electrical devices.
Innovation Solution
The use of a rigid-flex board with a flexible printed circuit board, adhering layer, and semi-solidified glue layer allows for direct assembly of the image sensor module into an electrical device, reducing costs by eliminating the need for ceramic substrates and anisotropic conductive adhesive films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a ceramic substrate is used to support the image sensor, then the flatness and optical axis alignment are improved, but the cost and manufacturing complexity increase
Solution Approach 1:
The patent extracts and removes the ceramic substrate from the traditional image sensor module structure. Instead of using a ceramic substrate to support the image sensor, the invention directly mounts the image sensor onto the FPCB, eliminating the intermediate ceramic substrate component and simplifying the overall structure while maintaining optical axis alignment capability
Solution Approach 2:
The FPCB is given multiple functions: it serves as both the electrical connection medium and the mechanical support structure for the image sensor. This multi-functional approach replaces the traditional separate ceramic substrate, reducing component count and assembly complexity while maintaining the necessary structural integrity and alignment
2Reliability
If a ceramic substrate with ACF is used, then the image sensor can be properly supported and connected, but the material cost and assembly cost increase
Solution Approach 1:
The patent merges the electrical connection function and the mechanical support function into a single integrated structure. The FPCB directly provides both electrical connectivity and mechanical support for the image sensor, eliminating the need for separate ceramic substrate and ACF materials, thereby reducing material costs while maintaining connection reliability
Solution Approach 2:
The invention replaces expensive ceramic substrates and ACF materials with more economical FPCB-based solutions. The FPCB serves as a cost-effective alternative that provides the necessary electrical and mechanical functions without requiring expensive specialized materials, reducing overall manufacturing cost
Data Source
AI summary
An image sensor module includes a rigid-flex board, an image sensor, and a supporting plate. The rigid-flex board defines a through hole, and includes a plurality of connecting pads adjacent to the through hole. The image sensor is positioned on one side of the rigid-flex board, and includes an image surface and a plurality of pins adjacent to the image surface. The image surface faces the through hole, and the pins are connected to the connecting pads. The supporting plate is positioned on the side of the rigid-flex board. The image sensor is positioned between the supporting plate and the rigid-flex board.