Rigid-Flex PCB Carrier Frame Lens Alignment
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Solution Overview
Problem
Existing electronic devices with rigid printed circuit boards (PCBs) face challenges in assembly, size constraints, and reliability issues, particularly in imaging devices where alignment and connectivity requirements add complexity and cost.
Innovation Solution
The use of a carrier frame to support PCBs, allowing for flexible and adjustable configurations, including rigid-flex PCBs that can be bent around the frame, along with a lens focus fix mechanism for precise focal adjustments without tools, reduces size and assembly complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid PCBs are used to support electronic components, then structural stability is improved, but device size and assembly complexity increase
Solution Approach 1:
The patent employs rigid-flex PCBs that combine rigid and flexible substrate layers. The rigid layers provide structural stability for mounting components, while the flexible layers enable the board to conform to the carrier frame contours and simplify assembly by eliminating the need for separate mounting brackets and fasteners.
Solution Approach 2:
The PCB is divided into multiple rigid and flexible layers that are laminated together. This segmentation allows different portions of the same board to have different mechanical properties - rigid sections for component mounting and flexible sections for adaptation to the carrier frame geometry.
2Reliability
If connectors are used to connect PCBs together, then connectivity is improved, but device size and cost increase
Solution Approach 1:
The patent integrates multiple PCB functions into a single rigid-flex board structure. By combining what would traditionally require separate boards and connectors into one continuous rigid-flex PCB, the design eliminates connector interfaces while maintaining all necessary electrical connections through the flexible circuit traces.
Solution Approach 2:
The rigid-flex PCB serves multiple functions simultaneously: it provides structural support, enables component mounting, achieves inter-board connectivity without connectors, and adapts to the carrier frame geometry. This multi-functionality reduces the overall component count and device size.
3Manufacturing precision
If rigid PCBs are used for lens alignment, then positioning precision is improved, but adjustability and serviceability worsen
Solution Approach 1:
The patent incorporates adjustable lens mounting mechanisms that allow the lens position to be dynamically adjusted after assembly. The rigid-flex PCB structure enables this adjustability through flexible mounting sections that can accommodate lens position variations while maintaining precise optical alignment when set.
Solution Approach 2:
The lens mounting system allows for parameter changes in lens position and orientation after device assembly. The rigid-flex construction provides the mechanical compliance needed to adjust lens parameters while maintaining the precision required for optical alignment.
4Stability of the object's composition
If multiple rigid PCBs are used to support components, then component stability is improved, but overall device size increases
Solution Approach 1:
The patent consolidates multiple separate rigid PCBs into a single integrated rigid-flex PCB structure. This merging maintains component stability through the rigid layers while reducing the overall device footprint by eliminating gaps and mounting structures required for separate boards.
Solution Approach 2:
The rigid-flex PCB is designed to nest within the carrier frame contours, with flexible sections allowing the board to conform to the available space. This nesting arrangement maximizes component stability while minimizing the external device dimensions.
Data Source
AI summary
An electronic device includes an electronic circuit board containing a processing element and a vision sensor. A carrier frame is used to support the electronic circuit board. An optical element is positioned over the sensor and supported by the carrier frame. The electronic circuit board is bent to reduce the length, thickness and/or width of the electronic device, without increasing the others of the length, thickness and/or width of the electronic device.